title: Enthalpy of mixing of liquid systems for lead free soldering: Ni-Sb-Sn system.
abstract: The partial and integral enthalpies of mixing of liquid ternary Ni-Sb-Sn alloys were determined along five sectionsxSb/xSn= 3:1,xSb/xSn= 1:1,xSb/xSn= 1:3,xNi/xSn= 1:4, andxNi/xSb= 1:4 at 1000 °C in a large compositional range using drop calorimetry techniques. The mixing enthalpy of Ni-Sb alloys was determined at the same temperature and described by a Redlich-Kister polynomial. The other binary data were carefully evaluated from literature values. Our measured ternary data were fitted on the basis of an extended Redlich-Kister-Muggianu model for substitutional solutions. Additionally, a comparison of these results to the extrapolation model of Toop is given. The entire ternary system shows exothermic values of ΔmixHranging from approx. -1300 J/mol, the minimum in the Sb-Sn binary system down to approx. -24,500 J/mol towards Ni-Sb. No significant ternary interaction could be deduced from our data.
authors.affiliation: Faculté des Sciences, Université Mohammed V-Agdal, Laboratoire de Chimie Physique Générale, Av. Ibn Batouta, B.P. 1014, Rabat, Morocco ; University of Vienna, Department of Inorganic Chemistry/Materials Chemistry, Währinger Str. 42, A-1090 Wien, Austria.
authors.forename: A
authors.initials: A
authors.lastname: Elmahfoudi
authors.forename: S
authors.initials: S
authors.lastname: Fürtauer
authors.forename: A
authors.initials: A
authors.lastname: Sabbar
authors.forename: H
authors.initials: H
authors.lastname: Flandorfer
keywords: Calorimetry; Lead free solders; Liquid alloys; Ni–Sb–Sn