title: Effect of adherend temperature on bond strengths of resin bonding systems to denture base resin and a semi-precious alloy.
abstract: This study investigated the effect of adherend temperature on shear bond strengths of auto-polymerizing resin to denture base resin and 4-META/MMA-TBBO resin to silver-palladium-copper-gold (Ag-Pd-Cu-Au) alloy. Bonding procedure was carried out when adherend temperature was 10, 23, 37, or 55°C, and shear bond strengths (SBSs) were measured before and after thermocycling. Before thermocycling, there were no significant differences in bond strength among the four adherend temperatures for each adhesive resin: 31.59±6.11-32.89±2.12 MPa for auto-polymerizing resin; 35.43±2.2-38.38±0.61 MPa for 4-META/MMA-TBBO resin. After thermocycling, optimal adherend temperature to achieve the highest bond strength was 37°C for auto-polymerizing resin to denture base resin (30.02±2.29 MPa) and 10ºC for 4-META/MMA-TBBO resin to Ag-Pd-Cu-Au alloy (37.14±2.17 MPa).
authors.affiliation: Department of Fixed Prosthetic Dentistry, Kagoshima University Graduate School of Medical and Dental Sciences, Kagoshima, Japan.
authors.forename: Sadaaki
authors.initials: S
authors.lastname: Murahara
authors.forename: Hiroyuki
authors.initials: H
authors.lastname: Minami
authors.forename: Shiro
authors.initials: S
authors.lastname: Suzuki
authors.forename: Kenji
authors.initials: K
authors.lastname: Sakoguchi
authors.forename: Daisaku
authors.initials: D
authors.lastname: Shiomuki
authors.forename: Yoshito
authors.initials: Y
authors.lastname: Minesaki
authors.forename: Takuo
authors.initials: T
authors.lastname: Tanaka
mesh_terms: D000268:Adhesiveness; D001896:Boron Compounds / Q000737:chemistry; D003300:Copper / Q000737:chemistry; D003722:Dental Alloys / Q000737:chemistry*; D001840:Dental Bonding; D003775:Dental Polishing / Q000379:methods; D003819:Denture Bases; D006047:Gold Alloys / Q000737:chemistry; D006358:Hot Temperature; D006801:Humans; D006813:Humidity; D008422:Materials Testing; D008689:Methacrylates / Q000737:chemistry; D008768:Methylmethacrylates / Q000737:chemistry; D008855:Microscopy, Electron, Scanning; D010165:Palladium / Q000737:chemistry; D058105:Polymerization; D019904:Polymethyl Methacrylate / Q000737:chemistry*; D019279:Resin Cements / Q000737:chemistry*; D033081:Shear Strength; D012834:Silver / Q000737:chemistry; D013314:Stress, Mechanical; D013499:Surface Properties; D013696:Temperature; D014227:Triazines / Q000737:chemistry
chemical_list: D001896:Boron Compounds; D003722:Dental Alloys; D006047:Gold Alloys; D008689:Methacrylates; D008768:Methylmethacrylates; D019279:Resin Cements; D014227:Triazines; C107059:V-Primer; D012834:Silver; D010165:Palladium; D003300:Copper; D019904:Polymethyl Methacrylate; C049495:Super-bond; C078282:G-C Unifast LC