title: Polymerization kinetics of dual-curing adhesive systems when used solely or in conjunction with chemically-cured resin cement.
abstract: OBJECTIVE
  To investigate the chemical polymerization kinetics of commercial dual-curing adhesive systems when used solely or in conjunction with chemically-curing resin cement.
  
  
  METHODS
  Four adhesive systems comprising simplified-step adhesives and activators (Prime&Bond NT with Self Cure Activator, Excite DSC, AQ Bond Plus, All-Bond SE) were used. The pH values of the adhesives and adhesive/activator blends were measured. Differential scanning calorimetry (DSC) was used to investigate the extent of the chemical polymerization of the adhesives when used alone or directly intermixed with a chemically-cured resin cement (C&B Cement) for 60 min (n = 5). The data derived from the DSC analysis were statistically compared using one-way ANOVA and the Games-Howell post-hoc test (α = 0.05).
  
  
  RESULTS
  All the adhesives were highly acidic; when they were blended with the respective activators, their pH values increased. Neither the adhesive/activator blends nor the adhesive alone/cement mixtures showed any detectable heat generation. The Prime&Bond NT/activator showed delayed heat generation only when intermixed with the catalyst/base paste. The other three adhesive systems produced similar exotherms when intermixed with the catalyst paste alone or with the catalyst/base paste (p > 0.05), but at significantly different maximum rates of polymerization (p < 0.05). Significantly shorter induction periods resulted when AQ Bond Plus and All- Bond SE were intermixed with the catalyst/base paste rather than with the catalyst paste alone (p = 0.004).
  
  
  CONCLUSIONS
  The chemical polymerization occurring at the adhesive system/resin cement interface appears highly dependent on the adhesive system used and may be considerably delayed.
authors.forename: Young Kyung
authors.initials: YK
authors.lastname: Kim
authors.forename: Ju-Na
authors.initials: JN
authors.lastname: Chun
authors.forename: Pyung Cheol
authors.initials: PC
authors.lastname: Kwon
authors.forename: Kyo-Han
authors.initials: KH
authors.lastname: Kim
authors.forename: Tae-Yub
authors.initials: TY
authors.lastname: Kwon
mesh_terms: D002152:Calorimetry, Differential Scanning; D003188:Composite Resins / Q000737:chemistry; D017220:Dentin-Bonding Agents / Q000737:chemistry; D006801:Humans; D006863:Hydrogen-Ion Concentration; D007700:Kinetics; D008422:Materials Testing; D008689:Methacrylates / Q000737:chemistry; D058105:Polymerization; D011109:Polymethacrylic Acids / Q000737:chemistry; D019279:Resin Cements / Q000737:chemistry*; D055116:Self-Curing of Dental Resins / Q000379:methods*; D013696:Temperature; D013997:Time Factors
chemical_list: C453842:AQ bond; C074864:All-Bond system; D003188:Composite Resins; D017220:Dentin-Bonding Agents; C420130:Excite cement; D008689:Methacrylates; D011109:Polymethacrylic Acids; C425843:Prime and Bond NT; D019279:Resin Cements; C474194:Self Cure adhesive