title: Rapid bonding of polydimethylsiloxane to stereolithographically manufactured epoxy components using a photogenerated intermediary layer.
abstract: We describe a low cost, photo-induced, room-temperature bonding technique for bonding epoxy components to flexible PDMS membranes in less than half an hour. Bond strengths (~350 kPa) were characterized by ISO-conform tensile testing for a popular stereolithography resin and found comparable bond strengths as reported for PDMS/PDMS bonds.
authors: Karlsruhe Institute of Technology (KIT), Institute of Microstructure Technology (IMT), Eggenstein-Leopoldshafen, Germany.
authors: Elisabeth
authors: E
authors: Wilhelm
authors: Christiane
authors: C
authors: Neumann
authors: Kai
authors: K
authors: Sachsenheimer
authors: Tobias
authors: T
authors: Schmitt
authors: Kerstin
authors: K
authors: Länge
authors: Bastian E
authors: BE
authors: Rapp