title: Integrated wide-angle scanner based on translating a curved mirror of acylindrical shape.
abstract: A wide angle microscanning architecture is presented in which the angular deflection is achieved by displacing the principle axis of a curved silicon micromirror of acylindrical shape, with respect to the incident beam optical axis. The micromirror curvature is designed to overcome the possible deformation of the scanned beam spot size during scanning. In the presented architecture, the optical axis of the beam lays in-plane with respect to the substrate opening the door for a completely integrated and self-aligned miniaturized scanner. A micro-optical bench scanning device, based on translating a 200 μm focal length micromirror by an electrostatic comb-drive actuator, is implemented on a silicon chip. The microelectromechanical system has a resonance frequency of 329 Hz and a quality factor of 22. A single-mode optical fiber is used as the optical source and inserted into a micromachined groove fabricated and lithographically aligned with the microbench. Optical deflection angles up to 110 degrees are demonstrated.
authors.affiliation: Université Paris-Est, Laboratoire ESYCOM, ESIEE Paris, Cité Descartes, F-93162 Noisy-le-Grand Cedex, France. ysabry@ieee.org
authors.forename: Yasser M
authors.initials: YM
authors.lastname: Sabry
authors.forename: Diaa
authors.initials: D
authors.lastname: Khalil
authors.forename: Bassam
authors.initials: B
authors.lastname: Saadany
authors.forename: Tarik
authors.initials: T
authors.lastname: Bourouina
mesh_terms: D004867:Equipment Design; D019544:Equipment Failure Analysis; D005246:Feedback; D005336:Fiber Optic Technology / Q000295:instrumentation*; D007909:Lenses; D008029:Lighting / Q000295:instrumentation*; D055617:Micro-Electrical-Mechanical Systems / Q000295:instrumentation*; D018511:Systems Integration