title: Fabrication of electrospun SiC fibers web/phenol resin composites for the application to high thermal conducting substrate.
abstract: Polycabosilane (PCS) could be spun to form fiber web by electrospinning PCS solution in 30% dimethylformide (DMF)/toluene solvent at 25 kV. The electrospun web is stabilized at 200 degrees C for 1 hour to connect fibers by softening PCS webs and pyrolysed to synthesize silicon carbide (SiC) webs at 1800 degrees C. The pyrolysis at 1800 degrees C increased the SiC crystal size to 45 nm from 3 nm at 1300 degrees C. However, the pyrolysis at 1800 degrees C forms pores on the surface of SiC fibers due to oxygen evaporation generated during thermals curing. SiC/phenol composite webs could be fabricated by infiltration of phenol resin and hot pressing. The thermal conductivity measurement indicates that higher SiC fibers filler contents increase the thermal conductivity up to 1.9 W/mK for 40% fraction of filler contents from 0.5 W/mK for 20% fraction of filler.
authors.affiliation: Nano-IT Convergence Center, Korea Institute of Ceramic Engineering and Technology, 233-5 Gasan-dong Geumcheon-gu, 153-801 Seoul, Korea.
authors.forename: Tae-Eon
authors.initials: TE
authors.lastname: Kim
authors.forename: Jin Chul
authors.initials: JC
authors.lastname: Bae
authors.forename: Kwang Yeon
authors.initials: KY
authors.lastname: Cho
authors.forename: Yong-Gun
authors.initials: YG
authors.lastname: Shul
authors.forename: Chang Yeoul
authors.initials: CY
authors.lastname: Kim
mesh_terms: D017554:Carbon Compounds, Inorganic / Q000737:chemistry*; D004563:Electrochemistry / Q000379:methods*; D008422:Materials Testing; D049329:Nanostructures / Q000737:chemistry* / Q000648:ultrastructure*; D010316:Particle Size; D010636:Phenols / Q000737:chemistry*; D012117:Resins, Synthetic / Q000737:chemistry*; D012399:Rotation; D017655:Silicon Compounds / Q000737:chemistry*; D013696:Temperature; D013814:Thermal Conductivity
chemical_list: D017554:Carbon Compounds, Inorganic; D010636:Phenols; D012117:Resins, Synthetic; D017655:Silicon Compounds; C022088:silicon carbide