title: Non-porous low-k dielectric films based on a new structural amorphous fluoropolymer.
abstract: A non-porous and amorphous fluoropolymer PFN with low dielectric constant of 2.33 and dielectric loss less than 1.2 × 10(-3) is reported here. PFN also exhibits good mechanical properties and high thermostability. This study is a new example of a fully dense material showing a low k value and having good thermo/mechanical properties.
authors.affiliation: Key Laboratory of Organofluorine Chemistry and Laboratory for Polymer Materials, Shanghai Institute of Organic Chemistry, Chinese Academy of Sciences, 345 Lingling Road, Shanghai 200032, P.R. China.
authors.forename: Chao
authors.initials: C
authors.lastname: Yuan
authors.forename: Kaikai
authors.initials: K
authors.lastname: Jin
authors.forename: Kai
authors.initials: K
authors.lastname: Li
authors.forename: Shen
authors.initials: S
authors.lastname: Diao
authors.forename: Jiawei
authors.initials: J
authors.lastname: Tong
authors.forename: Qiang
authors.initials: Q
authors.lastname: Fang
keywords: dielectric constant; fluoropolymers; insulators; low k materials; thin solid films