title: Copper nanowires as fully transparent conductive electrodes.
abstract: In pondering of new promising transparent conductors to replace the cost rising tin-doped indium oxide (ITO), metal nanowires have been widely concerned. Herein, we demonstrate an approach for successful synthesis of long and fine Cu nanowires (NWs) through a novel catalytic scheme involving nickel ions. Such Cu NWs in high aspect ratio (diameter of 16.2 ± 2 nm and length up to 40 μm) provide long distance for electron transport and, meanwhile, large space for light transmission. Transparent electrodes fabricated using the Cu NW ink achieve a low sheet resistance of 1.4 Ohm/sq at 14% transmittance and a high transparency of 93.1% at 51.5 Ohm/sq. The flexibility and stability were tested with 100-timebending by 180°and no resistance change occurred. Ohmic contact was achieved to the p- and n-GaN on blue light emitting diode chip and bright electroluminescence from the front face confirmed the excellent transparency.
authors.affiliation: Department of Materials Science and Engineering, College of Materials, Xiamen University, Xiamen 361005, P. R. China.
authors.forename: Huizhang
authors.initials: H
authors.lastname: Guo
authors.forename: Na
authors.initials: N
authors.lastname: Lin
authors.forename: Yuanzhi
authors.initials: Y
authors.lastname: Chen
authors.forename: Zhenwei
authors.initials: Z
authors.lastname: Wang
authors.forename: Qingshui
authors.initials: Q
authors.lastname: Xie
authors.forename: Tongchang
authors.initials: T
authors.lastname: Zheng
authors.forename: Na
authors.initials: N
authors.lastname: Gao
authors.forename: Shuping
authors.initials: S
authors.lastname: Li
authors.forename: Junyong
authors.initials: J
authors.lastname: Kang
authors.forename: Duanjun
authors.initials: D
authors.lastname: Cai
authors.forename: Dong-Liang
authors.initials: DL
authors.lastname: Peng
mesh_terms: D003300:Copper / Q000737:chemistry*; D003460:Crystallization / Q000379:methods; D004553:Electric Conductivity; D004566:Electrodes; D004867:Equipment Design; D019544:Equipment Failure Analysis; D008422:Materials Testing; D036103:Nanotechnology / Q000295:instrumentation* / Q000379:methods; D053770:Nanowires / Q000737:chemistry* / Q000648:ultrastructure*; D010316:Particle Size; D012031:Refractometry / Q000295:instrumentation*
chemical_list: D003300:Copper
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