title: Metal-organic frameworks capable of healing at low temperatures.
abstract: Filling crystalline gaps with small molecules can drive interfacial healing between anisotropic solids. Sufficient mobility from these fillers allows the process to happen at a low temperature of -56 °C. Mended bulk crystals show modulus leap from 4 to 12 GPa and hardness from 400 to 1000 MPa.
authors.affiliation: Department of Mechanical and Materials Engineering, University of Nebraska, Lincoln, Nebraska, 68588, USA.
authors.forename: Ziguang
authors.initials: Z
authors.lastname: Chen
authors.forename: Gonghua
authors.initials: G
authors.lastname: Wang
authors.forename: Zhanping
authors.initials: Z
authors.lastname: Xu
authors.forename: Hui
authors.initials: H
authors.lastname: Li
authors.forename: Alexandre
authors.initials: A
authors.lastname: Dhôtel
authors.forename: Xiao Cheng
authors.initials: XC
authors.lastname: Zeng
authors.forename: Banglin
authors.initials: B
authors.lastname: Chen
authors.forename: Jean-Marc
authors.initials: JM
authors.lastname: Saiter
authors.forename: Li
authors.initials: L
authors.lastname: Tan
keywords: healing; interfacial binding; low temperatures; metal-organic frameworks; welding