title: Mouldable all-carbon integrated circuits.
abstract: A variety of plastic products, ranging from those for daily necessities to electronics products and medical devices, are produced by moulding techniques. The incorporation of electronic circuits into various plastic products is limited by the brittle nature of silicon wafers. Here we report mouldable integrated circuits for the first time. The devices are composed entirely of carbon-based materials, that is, their active channels and passive elements are all fabricated from stretchable and thermostable assemblies of carbon nanotubes, with plastic polymer dielectric layers and substrates. The all-carbon thin-film transistors exhibit a mobility of 1,027 cm(2) V(-1) s(-1) and an ON/OFF ratio of 10(5). The devices also exhibit extreme biaxial stretchability of up to 18% when subjected to thermopressure forming. We demonstrate functional integrated circuits that can be moulded into a three-dimensional dome. Such mouldable electronics open new possibilities by allowing for the addition of electronic/plastic-like functionalities to plastic/electronic products, improving their designability.
authors.affiliation: Department of Quantum Engineering, Nagoya University, Furo-cho, Chikusa-ku, Nagoya, Aichi 464-8603, Japan.
authors.forename: Dong-Ming
authors.initials: DM
authors.lastname: Sun
authors.forename: Marina Y
authors.initials: MY
authors.lastname: Timmermans
authors.forename: Antti
authors.initials: A
authors.lastname: Kaskela
authors.forename: Albert G
authors.initials: AG
authors.lastname: Nasibulin
authors.forename: Shigeru
authors.initials: S
authors.lastname: Kishimoto
authors.forename: Takashi
authors.initials: T
authors.lastname: Mizutani
authors.forename: Esko I
authors.initials: EI
authors.lastname: Kauppinen
authors.forename: Yutaka
authors.initials: Y
authors.lastname: Ohno