3D multi-spectrum sensor system with face recognition.
This paper presents a novel three-dimensional (3D) multi-spectrum sensor system, which combines a 3D depth sensor and multiple optical sensors for different wavelengths. Various image sensors, such as visible, infrared (IR) and 3D sensors, have been introduced into the commercial market. Since each sensor has its own advantages under various environmental conditions, the performance of an application depends highly on selecting the correct sensor or combination of sensors. In this paper, a sensor system, which we will refer to as a 3D multi-spectrum sensor system, which comprises three types of sensors, visible, thermal-IR and time-of-flight (ToF), is proposed. Since the proposed system integrates information from each sensor into one calibrated framework, the optimal sensor combination for an application can be easily selected, taking into account all combinations of sensors information. To demonstrate the effectiveness of the proposed system, a face recognition system with light and pose variation is designed. With the proposed sensor system, the optimal sensor combination, which provides new effectively fused features for a face recognition system, is obtained.
Department of Electrical and Electronic Engineering, Yonsei University, 134 Shinchon-dong, Seodaemun-gu, Seoul 120-749, Korea. syleee@yonsei.ac.kr.
Joongrock
J
Kim
Sunjin
S
Yu
Ig-Jae
IJ
Kim
Sangyoun
S
Lee
D001699:Biometry / Q000295:instrumentation*; D003124:Colorimetry / Q000295:instrumentation*; D004867:Equipment Design; D019544:Equipment Failure Analysis; D005145:Face / Q000033:anatomy & histology*; D006801:Humans; D007090:Image Interpretation, Computer-Assisted / Q000295:instrumentation*; D021621:Imaging, Three-Dimensional / Q000295:instrumentation*; D010363:Pattern Recognition, Automated / Q000379:methods*; D014159:Transducers