title: Light turning mirrors for hybrid integration of SiON-based optical waveguides and photo-detectors.
abstract: For hybrid integration of an optical chip with an electronic chip containing photo-diodes and processing electronics, light must be coupled from the optical to the electronic chip. This paper presents a method to fabricate quasi-total-internal-reflecting mirrors on an optical chip, placed at an angle of 45° with the chip surface, that enable 90° out-of-plane light coupling between flip-chip bonded chips. The fabrication method utilizes a metal-free, parallel process and is fully compatible with conventional fabrication of optical chips. The mirrors are created using anisotropic etching of 45° facets in a Si substrate, followed by fabrication of the optical structures. After removal of the mirror-defining Si structures by isotropic etching, the obtained interfaces between optical structure and air direct the output from optical waveguides to out-of-plane photo-detectors on the electronic chip, which is aimed to be flip-chip mounted on the optical chip. For transverse-electric (transverse-magnetic) polarization simulations predict a functional loss of 7% (15%), while 7% (18%) is measured.
authors.forename: F
authors.initials: F
authors.lastname: Civitci
authors.forename: G
authors.initials: G
authors.lastname: Sengo
authors.forename: A
authors.initials: A
authors.lastname: Driessen
authors.forename: M
authors.initials: M
authors.lastname: Pollnau
authors.forename: A J
authors.initials: AJ
authors.lastname: Annema
authors.forename: H J W M
authors.initials: HJ
authors.lastname: Hoekstra