title: Peel-and-stick: mechanism study for efficient fabrication of flexible/transparent thin-film electronics.
abstract: Peel-and-stick process, or water-assisted transfer printing (WTP), represents an emerging process for transferring fully fabricated thin-film electronic devices with high yield and fidelity from a SiO2/Si wafer to various non-Si based substrates, including papers, plastics and polymers. This study illustrates that the fundamental working principle of the peel-and-stick process is based on the water-assisted subcritical debonding, for which water reduces the critical adhesion energy of metal-SiO2 interface by 70 ~ 80%, leading to clean and high quality transfer of thin-film electronic devices. Water-assisted subcritical debonding is applicable for a range of metal-SiO2 interfaces, enabling the peel-and-stick process as a general and tunable method for fabricating flexible/transparent thin-film electronic devices.
authors.affiliation: Department of Mechanical Engineering, Stanford University, CA, 94305, USA.
authors.forename: Chi Hwan
authors.initials: CH
authors.lastname: Lee
authors.forename: Jae-Han
authors.initials: JH
authors.lastname: Kim
authors.forename: Chenyu
authors.initials: C
authors.lastname: Zou
authors.forename: In Sun
authors.initials: IS
authors.lastname: Cho
authors.forename: Jeffery M
authors.initials: JM
authors.lastname: Weisse
authors.forename: William
authors.initials: W
authors.lastname: Nemeth
authors.forename: Qi
authors.initials: Q
authors.lastname: Wang
authors.forename: Adri C T
authors.initials: AC
authors.lastname: van Duin
authors.forename: Taek-Soo
authors.initials: TS
authors.lastname: Kim
authors.forename: Xiaolin
authors.initials: X
authors.lastname: Zheng