title: Surface state of sacrificial copper electrode by electropolishing in hydrophobic ionic liquid 1-butyl-3-methylimidazolium bis(trifluoromethylsulfonyl)imide.
abstract: Anodic dissolution of natural surface-oxidized, air-annealed, cathodically reduced, and cathodically deposited copper in hydrophobic ionic liquid 1-buthyl-3-methylimidazolium bis(trifluoromethylsulfonyl)imide under galvanostatic conditions by means of gravimetric measurements was studied. The resulting samples were mirror-like oxide-free copper pattern. The mechanism of the electropolishing of oxidized copper surface was considered. The consequent anodic reactions Cu2O - 1e = Cu(+) + CuO, CuO - 2e = Cu(2+) + O, and Cu - 1e = Cu(+) take place. The electropolishing itself occurs over oxygen-free copper surface due to competitive residual water discharge in the pits and copper dissolution on the roughness.
authors.affiliation: Department of Chemistry, Lomonosov Moscow State University , 119991 Moscow, Russia.
authors.forename: Olga
authors.initials: O
authors.lastname: Lebedeva
authors.forename: Gilyana
authors.initials: G
authors.lastname: Dzhungurova
authors.forename: Alexandre
authors.initials: A
authors.lastname: Zakharov
authors.forename: Dmitry
authors.initials: D
authors.lastname: Kultin
authors.forename: Leonid
authors.initials: L
authors.lastname: Kustov
authors.forename: Vladimir
authors.initials: V
authors.lastname: Krasovskii
authors.forename: Konstantin
authors.initials: K
authors.lastname: Kalmykov
authors.forename: Sergey
authors.initials: S
authors.lastname: Dunaev