title: Reliable metal deposition into TiO(2) nanotubes for leakage-free interdigitated electrode structures and use as a memristive electrode.
abstract: Nearly 100 % filling of TiO2 nanotubes with metals, including Ag, Cu, Au, and Pt, was achieved by defect-sealing treatment at the bottom of the nanotubes, followed by metal deposition using nuclei formation/coalescence. The resulting short-circuit-free interdigitated electrode configurations can, for example, be used to fabricate memristive electrodes.
authors.affiliation: Department of Materials Science WW4-LKO, University of Erlangen-Nuremberg, Martensstrasse 7, 91058 Erlangen (Germany).
authors.forename: Ning
authors.initials: N
authors.lastname: Liu
authors.forename: Kiyoung
authors.initials: K
authors.lastname: Lee
authors.forename: Patrik
authors.initials: P
authors.lastname: Schmuki
keywords: TiO2 nanotubes; electrodeposition; electrodes; sealing layer; semiconductors