title: Shape memory polymer nanocomposites for application of multiple-field active disassembly: experiment and simulation.
abstract: Active disassembly (AD) uses innovative materials that can perform a designed disassembly action by the application of an external field. AD provides improvements over current disassembly processes by limiting machine or manual labor and enabling batch processing for end-of-life products. With improved disassembly operations, more reuse of components and purer recycling streams may be seen. One problem with AD, however, has been with the single-field actuation because of the probability of accidental disassembly. This presentation will discuss the application of shape memory polymer (SMP) nanocomposites in a new AD process. This novel AD process requires multiple-field actuation of the SMP nanocomposite fastener. In the analysis of this AD process, thermal and magnetic field tests were performed on the SMP nanocomposite. From these tests, finite-element analysis was performed to model and simulate the multiple-field AD process. The results of the simulations provide performance variables for the AD process and show a better performance time for the SMP nanocomposite fastener than for a comparable SMP fastener.
authors.affiliation: Department of Industrial Engineering, and ‡Department of Mechanical Engineering, Texas Tech University , Lubbock, Texas 79409, United States.
authors.forename: John
authors.initials: J
authors.lastname: Carrell
authors.forename: Hong-Chao
authors.initials: HC
authors.lastname: Zhang
authors.forename: Shiren
authors.initials: S
authors.lastname: Wang
authors.forename: Derrick
authors.initials: D
authors.lastname: Tate
mesh_terms: D003198:Computer Simulation; D060328:Magnetic Phenomena; D008962:Models, Theoretical; D053761:Nanocomposites / Q000737:chemistry*; D011108:Polymers / Q000737:chemistry*; D044366:Transition Temperature
chemical_list: D011108:Polymers