title: Preparation of conductive Cu thin film by the reaction of Cu nitrate with polymers.
abstract: Cu nanoparticle-colloid was prepared by using electrical wire explosion process in liquid and it showed good dispersion stability without any kinds of additives. Mixed Cu nano-colloid was prepared with Cu nanoparticle-colloid, Copper (II) nitrate trihydrate, and polyvinyl pyrrolidone. Cu atoms are supplied from the dissociation reaction between Copper (II) nitrate trihydrate and polyvinyl pyrrolidone and fill up the gaps between Cu nanoparticles during the thermal sintering. Conductive (45 microOmega cm) Cu film was prepared at the sintering temperature of 200 degrees C by the enhancement of the formation of sintering necks.
authors.affiliation: Powder Technology Department, Korea Institute of Materials Science, 797, Changwon-daero, Changwon 642-831, Korea.
authors.forename: Sangsun
authors.initials: S
authors.lastname: Yang
authors.forename: Jae-Cheol
authors.initials: JC
authors.lastname: Yoon
authors.forename: Jung-Yeul
authors.initials: JY
authors.lastname: Yun
authors.forename: Yong-Jin
authors.initials: YJ
authors.lastname: Kim
authors.forename: Ji-Hun
authors.initials: JH
authors.lastname: Yu