title: Effect of nano-silica filler on the uniform packaging of white light emitting diodes.
abstract: The packaging process of white light-emitting diodes (WLEDs) take a relatively long time, even when utilizing an automated dispensing system. Therefore the silicone-based packaging formulation and control of rheology during the packaging of LEDs are very important. The effect of phosphor settling during the curing state of LED packaging has been reported. In this work we studied the effect of phosphor paste on the dispensing stage of the WLEDs packaging process utilizing nanosilica particles as viscosity modifiers. With nano-silica in the silicone resin the sedimentation of YAG phosphor particles were effectively blocked and a uniform distribution of YAG phosphor in the cured silicon resin could be achieved. We also examined the incorporation of red quantum dots (QDs) to improve the color rendering index of the WLEDs with the aid of nano-silica as a rheological additive. The application of nano-silica in the layer-by-layer type encapsulation of red QDs was found to be effective in WLEDs packaging, which improved the color rendering index with warm white emission.
authors.affiliation: Department of Sensor and Display Engineering, Kyungpook National University, Daegu, 702-701, South Korea.
authors.forename: Deok Jae
authors.initials: DJ
authors.lastname: Hyeon
authors.forename: Tea Hoon
authors.initials: TH
authors.lastname: Kim
authors.forename: Lee Soon
authors.initials: LS
authors.lastname: Park