Polystyrene films as barrier layers for corrosion protection of copper and copper alloys.
Dip-coated polystyrene layers of sub-micrometre thickness (85-500nm) have been applied on copper and copper alloys (aluminium brass, copper-nickel 70/30), as well as on stainless steel 304, and produced an effective barrier against corrosion and adhesion of corrosion-relevant microorganisms. According to the dynamic wettability measurements, the coatings exhibited high advancing (103°), receding (79°) and equilibrium (87°) contact angles, low contact angle hysteresis (6°) and surface free energy (31mJ/m(2)). The corrosion rate of copper-nickel 70/30 alloy samples in 3.5% NaCl was as low as 3.2μm/a (44% of that of the uncoated samples), and in artificial seawater was only 0.9μm/a (29% of that of the uncoated samples). Cell adhesion was studied by fluorescence microscopy, using monoculture of Desulfovibrio alaskensis. The coatings not only decreased the corrosion rate but also markedly reduced the number of bacterial cells adhered to the coated surfaces. The PS coating on copper gave the best result, 2×10(3)cells/cm(2) (1% of that of the uncoated control).
Department of Interfaces and Surface Modification, Institute of Materials and Environmental Chemistry, Research Centre for Natural Sciences, Hungarian Academy of Sciences, Pusztaszeri út 59-67., 1025 Budapest, Hungary. Electronic address: romanszki.lorand@ttk.mta.hu.
Loránd
L
Románszki
Aquatic Biotechnology, Biofilm Centre, Faculty of Chemistry, University of Duisburg-Essen, Universitätsstr. 5, 45141 Essen, Germany. Electronic address: yaryna.datsenko@gmail.com.
Iaryna
I
Datsenko
Department of Functional and Structural Materials, Institute of Materials and Environmental Chemistry, Research Centre for Natural Sciences, Hungarian Academy of Sciences, Pusztaszeri út 59-67., 1025 Budapest, Hungary. Electronic address: may.zoltan@ttk.mta.hu.
Zoltán
Z
May
Department of Interfaces and Surface Modification, Institute of Materials and Environmental Chemistry, Research Centre for Natural Sciences, Hungarian Academy of Sciences, Pusztaszeri út 59-67., 1025 Budapest, Hungary; Institute of Media Technology and Light Industry, Faculty of Light Industry and Environmental Engineering, Óbuda University, Doberdó u. 6., 1034 Budapest, Hungary. Electronic address: telegdi.judit@ttk.mta.hu.
Judit
J
Telegdi
Department of Interfaces and Surface Modification, Institute of Materials and Environmental Chemistry, Research Centre for Natural Sciences, Hungarian Academy of Sciences, Pusztaszeri út 59-67., 1025 Budapest, Hungary. Electronic address: nyikos.lajos@ttk.mta.hu.
Lajos
L
Nyikos
Aquatic Biotechnology, Biofilm Centre, Faculty of Chemistry, University of Duisburg-Essen, Universitätsstr. 5, 45141 Essen, Germany. Electronic address: wolfgang.sand@uni-due.de.
Wolfgang
W
Sand
D000497:Alloys / Q000737:chemistry*; D000535:Aluminum / Q000737:chemistry; D001422:Bacterial Adhesion; D003300:Copper / Q000737:chemistry*; D003343:Corrosion; D003901:Desulfovibrio / Q000502:physiology*; D008420:Manufactured Materials / Q000032:analysis / Q000382:microbiology*; D009532:Nickel / Q000737:chemistry*; D011137:Polystyrenes / Q000737:chemistry*; D013193:Stainless Steel / Q000737:chemistry; D013499:Surface Properties
D000497:Alloys; D011137:Polystyrenes; C062136:nickel copper alloy; D013193:Stainless Steel; D003300:Copper; D009532:Nickel; D000535:Aluminum
Aluminium brass; Copper–nickel; Desulfovibrio alaskensis; Microbial corrosion; Nanolayer