Enhancement of thermal conductive pathway of boron nitride coated polymethylsilsesquioxane composite.
We report here in the fabrication of enhanced thermal conductive pathway nanocomposites of boron nitride (BN)-coated polymethylsilsesquioxane (PMSQ) composite beads using isopropyl alcohol (IPA) as a mixing medium. Exfoliated and size-reduced boron nitride particles were successfully coated on the PMSQ beads and explained by surface charge differences. A homogeneous dispersion and coating of BN on the PMSQ beads using IPA medium was confirmed by SEM. Each condition of the composite powder was carried into the stainless still mould and then hot pressed in an electrically heated hot press machine. Three-dimensional percolation networks and conductive pathways created by exfoliated BN were precisely formed in the nanocomposites. The thermal conductivity of nanocomposites was measured by multiplying specific gravity, specific heat, and thermal diffusivity, based upon the laser flash method. Densification of the composite resulted in better thermal properties. For an epoxy reinforced composite with 30 vol% BN and PMSQ, a thermal conductivity of nine times higher than that of pristine PMSQ was observed.
Department of Bionano Technology/Fusion Chemical Enginnering, Hanyang University, Ansan 426-791, Korea.
Gyungbok
G
Kim
Seung Han
SH
Ryu
Jun-Tae
JT
Lee
Ki-Hun
KH
Seong
Jae Eun
JE
Lee
Phil-Joong
PJ
Yoon
Bum-Sung
BS
Kim
Manwar
M
Hussain
Yong-Ho
YH
Choa
D000327:Adsorption; D001896:Boron Compounds / Q000737:chemistry*; D046911:Macromolecular Substances / Q000737:chemistry; D008422:Materials Testing; D008968:Molecular Conformation; D049329:Nanostructures / Q000737:chemistry* / Q000648:ultrastructure*; D017646:Organosilicon Compounds / Q000737:chemistry*; D010316:Particle Size; D011108:Polymers / Q000737:chemistry*; D013046:Specific Gravity; D013499:Surface Properties; D013814:Thermal Conductivity
D001896:Boron Compounds; D046911:Macromolecular Substances; D017646:Organosilicon Compounds; D011108:Polymers; C017282:boron nitride; C532869:polymethylsilsesquioxane