title: Mechanics of finger-tip electronics.
abstract: Tactile sensors and electrotactile stimulators can provide important links between humans and virtual environments, through the sensation of touch. Soft materials, such as low modulus silicones, are attractive as platforms and support matrices for arrays sensors and actuators that laminate directly onto the fingertips. Analytic models for the mechanics of three dimensional, form-fitting finger cuffs based on such designs are presented here, along with quantitative validation using the finite element method. The results indicate that the maximum strains in the silicone and the embedded devices are inversely proportional to the square root of radius of curvature of the cuff. These and other findings can be useful in formulating designs for these and related classes of body-worn, three dimensional devices.
authors.forename: Yewang
authors.initials: Y
authors.lastname: Su
authors.forename: Rui
authors.initials: R
authors.lastname: Li
authors.forename: Huanyu
authors.initials: H
authors.lastname: Cheng
authors.forename: Ming
authors.initials: M
authors.lastname: Ying
authors.forename: Andrew P
authors.initials: AP
authors.lastname: Bonifas
authors.forename: Keh-Chih
authors.initials: KC
authors.lastname: Hwang
authors.forename: John A
authors.initials: JA
authors.lastname: Rogers
authors.forename: Yonggang
authors.initials: Y
authors.lastname: Huang