title: Ultrarapid formation of homogeneous Cu6Sn5 and Cu3Sn intermetallic compound joints at room temperature using ultrasonic waves.
abstract: Homogeneous intermetallic compound joints are demanded by the semiconductor industry because of their high melting point. In the present work, ultrasonic vibration was applied to Cu/Sn foil/Cu interconnection system at room temperature to form homogeneous Cu6Sn5 and Cu3Sn joints. Compared with other studies based on transient-liquid-phase soldering, the processing time of our method was dramatically reduced from several hours to several seconds. This ultrarapid intermetallic phase formation process resulted from accelerated interdiffusion kinetics, which can be attributed to the sonochemical effects of acoustic cavitation at the interface between the liquid Sn and the solid Cu during the ultrasonic bonding process.
authors.affiliation: Shenzhen Key Laboratory of Advanced Materials, Harbin Institute of Technology Shenzhen Graduate School, Shenzhen 518055, China.
authors.forename: Zhuolin
authors.initials: Z
authors.lastname: Li
authors.affiliation: Shenzhen Key Laboratory of Advanced Materials, Harbin Institute of Technology Shenzhen Graduate School, Shenzhen 518055, China; State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China. Electronic address: myli@hit.edu.cn.
authors.forename: Mingyu
authors.initials: M
authors.lastname: Li
authors.affiliation: Shenzhen Key Laboratory of Advanced Materials, Harbin Institute of Technology Shenzhen Graduate School, Shenzhen 518055, China.
authors.forename: Yong
authors.initials: Y
authors.lastname: Xiao
authors.affiliation: State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China. Electronic address: wangcq@hit.edu.cn.
authors.forename: Chunqing
authors.initials: C
authors.lastname: Wang
keywords: Cavitation; Erosion; Intermetallic compounds; Ultrasonic waves