title: Deep sub micrometer imaging of defects in copper pillars by X-ray tomography in a SEM.
abstract: The potential of X-ray nanotomography hosted in a SEM in presented in this paper. In order to improve the detail detectability of this system, which is directly related to the X-ray source size, thin metal layers have been studied and installed in the equipment. A 3D resolution pattern has been created in order to determine the smallest detectable features by this setup. This sample is a 25 μm diameter copper pillar in which size-controlled holes have been milled using a plasma-focused ion beam. This pattern has then been scanned and the resulting 3D reconstruction demonstrates that the instrument is able to detect 500 nm diameter voids in a copper interconnection, as used in 3D integration.
authors: STMicroelectronics, 850 rue Jean Monnet, 38926 Crolles, France; CEA, LETI, MINATEC Campus, 17 rue des Martyrs, 38054 Grenoble Cedex 9, France. Electronic address: david.laloum@cea.fr.
authors: D
authors: D
authors: Laloum
authors: STMicroelectronics, 850 rue Jean Monnet, 38926 Crolles, France.
authors: F
authors: F
authors: Lorut
authors: STMicroelectronics, 850 rue Jean Monnet, 38926 Crolles, France; CEA, LETI, MINATEC Campus, 17 rue des Martyrs, 38054 Grenoble Cedex 9, France.
authors: J
authors: J
authors: Bertheau
authors: CEA, LETI, MINATEC Campus, 17 rue des Martyrs, 38054 Grenoble Cedex 9, France.
authors: G
authors: G
authors: Audoit
authors: CEA, LETI, MINATEC Campus, 17 rue des Martyrs, 38054 Grenoble Cedex 9, France.
authors: P
authors: P
authors: Bleuet
keywords: 3D integration; Copper pillar; Nanotomography; Plasma FIB; SEM; X-ray