title: Etching rate enhancement by shaped femtosecond pulse train electron dynamics control for microchannels fabrication in fused silica glass.
abstract: The dependence of the etching rate on the ultrafast pulse shaping is observed when microchannels are fabricated in fused silica glass using the method of femtosecond laser irradiation followed by chemical etching. In comparison with the conventional femtosecond pulses, the temporally shaped pulse trains can greatly enhance the etching rate under the same processing conditions. The enhancement is mainly attributed to the localized transient electron dynamics control by shaping the ultrafast pulse, resulting in higher photon absorption efficiency and uniform photomodification zone. Furthermore, processing parameters, including pulse delay and pulse energy distribution ratio, have also been investigated to optimize microchannels fabrication.
authors: Pengjun
authors: P
authors: Liu
authors: Lan
authors: L
authors: Jiang
authors: Jie
authors: J
authors: Hu
authors: Xueliang
authors: X
authors: Yan
authors: Bo
authors: B
authors: Xia
authors: Yongfeng
authors: Y
authors: Lu
mesh_terms: D004867:Equipment Design; D019544:Equipment Failure Analysis; D005898:Glass / Q000737:chemistry* / Q000528:radiation effects*; D006361:Heating; D008422:Materials Testing; D046228:Microarray Analysis / Q000295:instrumentation*; D012822:Silicon Dioxide / Q000737:chemistry* / Q000528:radiation effects*; D013499:Surface Properties / Q000528:radiation effects
chemical_list: D012822:Silicon Dioxide