title: Multiwavelength shearing interferometry for measuring the slopes, curvatures, and shapes of thin films/substrate systems.
abstract: Multiwavelength shearing interferometry, a full-field, real-time, and vibration-insensitive method with enhanced accuracy, is proposed. Theoretically, the more wavelengths that are used for shearing interferometers, the higher the precision that can be achieved in the measurement of slopes, curvatures, and the shapes of reflective surfaces. A spherical mirror with specified curvature radius is used to calibrate this method, and then the nonuniform deformation and shape of the TiNi film/Si substrate system are obtained experimentally.
authors.forename: Changxing
authors.initials: C
authors.lastname: Zhang
authors.forename: Xuelin
authors.initials: X
authors.lastname: Dong
authors.forename: Xue
authors.initials: X
authors.lastname: Feng
authors.forename: Keh-Chih
authors.initials: KC
authors.lastname: Hwang