title: Assembling surface mounted components on ink-jet printed double sided paper circuit board.
abstract: Printed electronics is a rapidly developing field where many components can already be manufactured on flexible substrates by printing or by other high speed manufacturing methods. However, the functionality of even the most inexpensive microcontroller or other integrated circuit is, at the present time and for the foreseeable future, out of reach by means of fully printed components. Therefore, it is of interest to investigate hybrid printed electronics, where regular electrical components are mounted on flexible substrates to achieve high functionality at a low cost. Moreover, the use of paper as a substrate for printed electronics is of growing interest because it is an environmentally friendly and renewable material and is, additionally, the main material used for many packages in which electronics functionalities could be integrated. One of the challenges for such hybrid printed electronics is the mounting of the components and the interconnection between layers on flexible substrates with printed conductive tracks that should provide as low a resistance as possible while still being able to be used in a high speed manufacturing process. In this article, several conductive adhesives are evaluated as well as soldering for mounting surface mounted components on a paper circuit board with ink-jet printed tracks and, in addition, a double sided Arduino compatible circuit board is manufactured and programmed.
authors: Department of Electronics Design, Mid Sweden University, SE-851 70 Sundsvall, Sweden.
authors: Henrik A
authors: HA
authors: Andersson
authors: Anatoliy
authors: A
authors: Manuilskiy
authors: Stefan
authors: S
authors: Haller
authors: Magnus
authors: M
authors: Hummelgård
authors: Johan
authors: J
authors: Sidén
authors: Christine
authors: C
authors: Hummelgård
authors: Håkan
authors: H
authors: Olin
authors: Hans-Erik
authors: HE
authors: Nilsson