title: A self-reducible and alcohol-soluble copper-based metal-organic decomposition ink for printed electronics.
abstract: We report a novel method for the synthesis of a self-reducible (thermally reducible without a reducing atmosphere) and alcohol-soluble copper-based metal-organic decomposition (MOD) ink for printed electronics. Alcohol-solvent-based conductive inks are necessary for commercial printing processes such as reverse offset printing. We selected copper(II) formate as a precursor and alkanolamine (2-amino-2-methyl-1-propanol) as a ligand to make an alcohol-solvent-based conductive ink and to assist in the reduction reaction of copper(II) formate. In addition, a co-complexing agent (octylamine) and a sintering helper (hexanoic acid) were introduced to improve the metallic copper film. The specific resistivity of copper-based MOD ink (Cuf-AMP-OH ink) after heat treatment at 350 °C is 9.46 μΩ·cm, which is 5.5 times higher than the specific resistivity of bulk copper. A simple stamping transfer was conducted to demonstrate the potential of our ink for commercial printing processes.
authors: Program in Nano Science and Technology, Graduate School of Convergence Science and Technology, Seoul National University , Suwon 443-270, Republic of Korea.
authors: Dong-Hun
authors: DH
authors: Shin
authors: Seunghee
authors: S
authors: Woo
authors: Hyesuk
authors: H
authors: Yem
authors: Minjeong
authors: M
authors: Cha
authors: Sanghun
authors: S
authors: Cho
authors: Mingyu
authors: M
authors: Kang
authors: Sooncheol
authors: S
authors: Jeong
authors: Yoonhyun
authors: Y
authors: Kim
authors: Kyungtae
authors: K
authors: Kang
authors: Yuanzhe
authors: Y
authors: Piao