title: Thermal properties of graphene-copper-graphene heterogeneous films.
abstract: We demonstrated experimentally that graphene-Cu-graphene heterogeneous films reveal strongly enhanced thermal conductivity as compared to the reference Cu and annealed Cu films. Chemical vapor deposition of a single atomic plane of graphene on both sides of 9 μm thick Cu films increases their thermal conductivity by up to 24% near room temperature. Interestingly, the observed improvement of thermal properties of graphene-Cu-graphene heterofilms results primarily from the changes in Cu morphology during graphene deposition rather than from graphene's action as an additional heat conducting channel. Enhancement of thermal properties of graphene-capped Cu films is important for thermal management of advanced electronic chips and proposed applications of graphene in the hybrid graphene-Cu interconnect hierarchies.
authors.affiliation: Nano-Device Laboratory, Department of Electrical Engineering, Bourns College of Engineering, University of California - Riverside , Riverside, California 92521, United States.
authors.forename: Pradyumna
authors.initials: P
authors.lastname: Goli
authors.forename: Hao
authors.initials: H
authors.lastname: Ning
authors.forename: Xuesong
authors.initials: X
authors.lastname: Li
authors.forename: Ching Yu
authors.initials: CY
authors.lastname: Lu
authors.forename: Konstantin S
authors.initials: KS
authors.lastname: Novoselov
authors.forename: Alexander A
authors.initials: AA
authors.lastname: Balandin