title: An integrated thermal compensation system for MEMS inertial sensors.
abstract: An active thermal compensation system for a low temperature-bias-drift (TBD) MEMS-based gyroscope is proposed in this study. First, a micro-gyroscope is fabricated by a high-aspect-ratio silicon-on-glass (SOG) process and vacuum packaged by glass frit bonding. Moreover, a drive/readout ASIC, implemented by the 0.25 µm 1P5M standard CMOS process, is designed and integrated with the gyroscope by directly wire bonding. Then, since the temperature effect is one of the critical issues in the high performance gyroscope applications, the temperature-dependent characteristics of the micro-gyroscope are discussed. Furthermore, to compensate the TBD of the micro-gyroscope, a thermal compensation system is proposed and integrated in the aforementioned ASIC to actively tune the parameters in the digital trimming mechanism, which is designed in the readout ASIC. Finally, some experimental results demonstrate that the TBD of the micro-gyroscope can be compensated effectively by the proposed compensation system.
authors.affiliation: Microsystems Technology Center, Industrial Technology Research Institute, Tainan 709, Taiwan. samuel.csr@itri.org.tw.
authors.forename: Sheng-Ren
authors.initials: SR
authors.lastname: Chiu
authors.affiliation: Microsystems Technology Center, Industrial Technology Research Institute, Tainan 709, Taiwan. litaoteng@itri.org.tw.
authors.forename: Li-Tao
authors.initials: LT
authors.lastname: Teng
authors.affiliation: Microsystems Technology Center, Industrial Technology Research Institute, Tainan 709, Taiwan. wayne.chao@itri.org.tw.
authors.forename: Jen-Wei
authors.initials: JW
authors.lastname: Chao
authors.affiliation: Microsystems Technology Center, Industrial Technology Research Institute, Tainan 709, Taiwan. cysue@itri.org.tw.
authors.forename: Chung-Yang
authors.initials: CY
authors.lastname: Sue
authors.affiliation: Microsystems Technology Center, Industrial Technology Research Institute, Tainan 709, Taiwan. matthewlin@itri.org.tw.
authors.forename: Chih-Hsiou
authors.initials: CH
authors.lastname: Lin
authors.affiliation: Microsystems Technology Center, Industrial Technology Research Institute, Tainan 709, Taiwan. chris.chen@itri.org.tw.
authors.forename: Hong-Ren
authors.initials: HR
authors.lastname: Chen
authors.affiliation: Institute of Microelectronics and Department of Electrical Engineering, Advanced Optoelectronic Technology Center, National Cheng Kung University, Tainan 701, Taiwan. yksu@mail.ncku.edu.tw.
authors.forename: Yan-Kuin
authors.initials: YK
authors.lastname: Su