title: Moiré interferometry with high alignment resolution in proximity lithographic process.
abstract: Moiré interferometry is widely used as the precise metrology in many science and engineering fields. The schemes of moirés-based interferometry adopting diffraction gratings are presented in this paper for applications in a proximity lithographic system such as wafer-mask alignment, the in-plane twist angle adjustment, and tilts remediation. For the sake of adjustment of lateral offset as well as the tilt and in-plane twist angle, schemes of the (m,-m) and (m,0) moiré interferometry are explored, respectively. Fundamental derivation of the moiré interferometry and schemes for related applications are provided. Three pairs of gratings with close periods are fabricated to form the composite grating. And experiments are performed to confirm the moiré interferometry for related applications in our proximity lithographic system. Experimental results indicate that unaligned lateral offset is detectable with resolution at the nanometer level, and the tilt and in-plane twist angle between wafer and mask could be manually decreased down to the scope of 10(-3) and 10(-4)  rad, respectively.
authors.forename: Shaolin
authors.initials: S
authors.lastname: Zhou
authors.forename: Song
authors.initials: S
authors.lastname: Hu
authors.forename: Yongqi
authors.initials: Y
authors.lastname: Fu
authors.forename: Xiangmin
authors.initials: X
authors.lastname: Xu
authors.forename: Jun
authors.initials: J
authors.lastname: Yang