title: Fast and accurate finite element analysis of large-scale three-dimensional photonic devices with a robust domain decomposition method.
abstract: A fast and accurate full-wave technique based on the dual-primal finite element tearing and interconnecting method and the second-order transmission condition is presented for large-scale three-dimensional photonic device simulations. The technique decomposes a general three-dimensional electromagnetic problem into smaller subdomain problems so that parallel computing can be performed on distributed-memory computer clusters to reduce the simulation time significantly. With the electric fields computed everywhere, photonic device parameters such as transmission and reflection coefficients are extracted. Several photonic devices, with simulation volumes up to 1.9×10(4) (λ/n(avg))3 and modeled with over one hundred million unknowns, are simulated to demonstrate the application, efficiency, and capability of this technique. The simulations show good agreement with experimental results and in a special case with a simplified two-dimensional simulation.
authors.forename: Ming-Feng
authors.initials: MF
authors.lastname: Xue
authors.forename: Young Mo
authors.initials: YM
authors.lastname: Kang
authors.forename: Amir
authors.initials: A
authors.lastname: Arbabi
authors.forename: Steven J
authors.initials: SJ
authors.lastname: McKeown
authors.forename: Lynford L
authors.initials: LL
authors.lastname: Goddard
authors.forename: Jian-Ming
authors.initials: JM
authors.lastname: Jin