title: Compact 100Gb/s DP-QPSK integrated receiver module employing three-dimensional assembly technology.
abstract: We demonstrate a compact 100 Gbit/s DP-QPSK receiver module that is only 18 mm (W) x 16 mm (D) x 2.8 mm (H). The module size is reduced by using a ball grid array (BGA) package with three-dimensional assembly technology and by applying a heterogeneous integrated PLC. Error-free DP-QPSK signal demodulation is successfully demonstrated.
authors.forename: H
authors.initials: H
authors.lastname: Tanobe
authors.forename: Y
authors.initials: Y
authors.lastname: Kurata
authors.forename: Y
authors.initials: Y
authors.lastname: Nakanishi
authors.forename: H
authors.initials: H
authors.lastname: Fukuyama
authors.forename: M
authors.initials: M
authors.lastname: Itoh
authors.forename: E
authors.initials: E
authors.lastname: Yoshida