Feedback tolerance of DFB laser for silicon photonics packaging.
Silicon photonics packaging without optical isolator is of significant importance to realize low fabrication cost and small device size. In this report, impact of external feedback on DFB laser performance is investigated both theoretically and experimentally. Dynamic transfer matrix method and rate equation model are coupled to describe the dynamic interaction between optical field and carriers in a DFB structure under the feedback by external reflection. The calculation model exhibits laser spectrum splits and output intensity fluctuates with increase of the degree of external feedback, in good agreement with experimental results. The theoretical analysis is performed under various feedback parameters, and the optimum packaging condition for DFB laser chip in silicon photonics is guided.
Seiji
S
Takeda
Shigeru
S
Nakagawa