Highly thermal conductive copper nanowire composites with ultralow loading: toward applications as thermal interface materials.
Thermal interface materials (TIMs) are of ever-rising importance with the development of modern microelectronic devices. However, traditional TIMs exhibit low thermal conductivity even at high loading fractions. The use of high-aspect-ratio material is beneficial to achieve low percolation threshold for nanocomposites. In this work, single crystalline copper nanowires with large aspect ratio were used as filling materials for the first time. A thermal conductivity of 2.46 W/mK was obtained at an ultralow loading fraction, ∼0.9 vol %, which was enhanced by 1350% compared with plain matrix. Such an excellent performance makes copper nanowires attractive fillers for high-performance TIMs.
The State Key Lab of High Performance Ceramics and Superfine Microstructure, Shanghai Institute of Ceramics, Chinese Academy of Science , 1295 Dingxi Road, Shanghai 200050, P. R. China.
Shouling
S
Wang
Yin
Y
Cheng
Ranran
R
Wang
Jing
J
Sun
Lian
L
Gao