title: Magnetic field effects on copper metal deposition from copper sulfate aqueous solution.
abstract: Effects of a magnetic field (≤0.5 T) on electroless copper metal deposition from the reaction of a copper sulfate aqueous solution and a zinc thin plate were examined in this study. In a zero field, a smooth copper thin film grew steadily on the plate. In a 0.38 T field, a smooth copper thin film deposited on a zinc plate within about 1 min. Then, it peeled off repeatedly from the plate. The yield of consumed copper ions increased about 2.1 times compared with that in a zero field. Mechanism of this magnetic field effect was discussed in terms of Lorentz force- and magnetic force-induced convection and local volta cell formation.
authors.affiliation: Faculty of Pharmacy, Osaka Ohtani University , Tondabayashi 584-8540, Japan.
authors.forename: Chikako
authors.initials: C
authors.lastname: Udagawa
authors.forename: Aya
authors.initials: A
authors.lastname: Maeda
authors.forename: Akio
authors.initials: A
authors.lastname: Katsuki
authors.forename: Syou
authors.initials: S
authors.lastname: Maki
authors.forename: Shotaro
authors.initials: S
authors.lastname: Morimoto
authors.forename: Yoshifumi
authors.initials: Y
authors.lastname: Tanimoto
mesh_terms: D000327:Adsorption; D003300:Copper / Q000032:analysis*; D019327:Copper Sulfate / Q000737:chemistry*; D004867:Equipment Design; D060526:Magnetic Fields; D008280:Magnetics / Q000295:instrumentation; D015032:Zinc / Q000737:chemistry*
chemical_list: D003300:Copper; D015032:Zinc; D019327:Copper Sulfate