Converting non-metallic printed circuit boards waste into a value added product.
The aim of this study was to investigate the feasibility of using nonmetallic printed circuit board (PCB) waste as filler in recycled HDPE (rHDPE) in production of rHDPE/PCB composites. Maleic anhydride modified linear low-density polyethylene (MAPE) was used as compatibilizer. In particular, the effects of nonmetallic PCB and MAPE on mechanical properties of the composites were assessed through tensile, flexural and impact testing. Scanning electron microscope (SEM) was used to study the dispersion of nonmetallic PCB and MAPE in the matrix. Nonmetallic PCB was blended with rHDPE from 0-30 wt% and prepared by counter-rotating twin screw extruder followed by molding into test samples via hot press for analysis. A good balance between stiffness, strength and toughness was achieved for the system containing 30 wt% PCB. Thus, this system was chosen in order to investigate the effect of the compatibilizer on the mechanical properties of the composites. The results indicate that MAPE as a compatiblizer can effectively promote the interfacial adhesion between nonmetallic PCB and rHDPE. The addition of 6 phr MAPE increased the flexural strength, tensile strength and impact strength by 71%, 98% and 44% respectively compared to the uncompatibilized composites.
Department of Environmental, Faculty of Civil Engineering, Universiti Teknologi Malaysia, 81310 UTM, Skudai, Johor, Malaysia.
Shantha Kumari
SK
Muniyandi
Department of Environmental, Faculty of Civil Engineering, Universiti Teknologi Malaysia, 81310 UTM, Skudai, Johor, Malaysia.
Johan
J
Sohaili
Department of Polymer Engineering, Faculty of Chemical Engineering, Universiti Teknologi Malaysia, 81310 UTM, Skudai, Johor, Malaysia.
Azman
A
Hassan
Department of Environmental, Faculty of Civil Engineering, Universiti Teknologi Malaysia, 81310 UTM, Skudai, Johor, Malaysia.
Siti Suhaila
SS
Mohamad
Compatibilizer; Mechanical properties; Morphological; Nonmetallic; Printed circuit board