title: Direct writing of graphene patterns on insulating substrates under ambient conditions.
abstract: To unleash the full potential of graphene in electronics and optoelectronics, high-quality graphene patterns on insulating substrates are required. However, existing methods generally follow a "synthesis + patterning" strategy, which are time consuming and costly for fabricating high-quality graphene patterns on desired substrates. We developed a nanofabrication process to deposit high-quality graphene patterns directly on insulating substrates via a solid-phase laser direct writing (LDW) process. Open-air and room-temperature fabrication of graphene patterns on insulating substrates has been achieved via a femtosecond LDW process without graphene transfer and patterning. Various graphene patterns, including texts, spirals, line arrays, and integrated circuit patterns, with a feature line width of 800 nm and a low sheet resistance of 205 ohm/sq, were fabricated. The LDW method provides a facile and cost-effective way to fabricate complex and high-quality graphene patterns directly on target substrates, which opens a door for fabricating various advanced functional devices.
authors.affiliation: Department of Electrical Engineering, University of Nebraska-Lincoln, Lincoln, Nebraska, 68588-0511, USA.
authors.forename: Wei
authors.initials: W
authors.lastname: Xiong
authors.affiliation: Department of Electrical Engineering, University of Nebraska-Lincoln, Lincoln, Nebraska, 68588-0511, USA.
authors.forename: Yun Shen
authors.initials: YS
authors.lastname: Zhou
authors.affiliation: Department of Electrical Engineering, University of Nebraska-Lincoln, Lincoln, Nebraska, 68588-0511, USA.
authors.forename: Wen Jia
authors.initials: WJ
authors.lastname: Hou
authors.affiliation: Department of Electrical Engineering, University of Nebraska-Lincoln, Lincoln, Nebraska, 68588-0511, USA.
authors.forename: Li Jia
authors.initials: LJ
authors.lastname: Jiang
authors.affiliation: Department of Electrical Engineering, University of Nebraska-Lincoln, Lincoln, Nebraska, 68588-0511, USA.
authors.forename: Yang
authors.initials: Y
authors.lastname: Gao
authors.affiliation: Department of Electrical Engineering, University of Nebraska-Lincoln, Lincoln, Nebraska, 68588-0511, USA.
authors.forename: Li Sha
authors.initials: LS
authors.lastname: Fan
authors.affiliation: Department of Mechanical and Automation Engineering, Beijing Institute of Technology, Beijing, 100081, China.
authors.forename: Lan
authors.initials: L
authors.lastname: Jiang
authors.affiliation: Institute of Chemistry of Condensed Matter of Bordeaux, ICMCB-CNRS 87, Avenue du Docteur Albert Schweitzer F-33608 Pessac Cedex, France.
authors.forename: Jean Francois
authors.initials: JF
authors.lastname: Silvain
authors.affiliation: Department of Electrical Engineering, University of Nebraska-Lincoln, Lincoln, Nebraska, 68588-0511, USA.
authors.forename: Yong Feng
authors.initials: YF
authors.lastname: Lu