Synthesis of a nano-silver metal ink for use in thick conductive film fabrication applied on a semiconductor package.
The success of printing technology in the electronics industry primarily depends on the availability of metal printing ink. Various types of commercially available metal ink are widely used in different industries such as the solar cell, radio frequency identification (RFID) and light emitting diode (LED) industries, with limited usage in semiconductor packaging. The use of printed ink in semiconductor IC packaging is limited by several factors such as poor electrical performance and mechanical strength. Poor adhesion of the printed metal track to the epoxy molding compound is another critical factor that has caused a decline in interest in the application of printing technology to the semiconductor industry. In this study, two different groups of adhesion promoters, based on metal and polymer groups, were used to promote adhesion between the printed ink and the epoxy molding substrate. The experimental data show that silver ink with a metal oxide adhesion promoter adheres better than silver ink with a polymer adhesion promoter. This result can be explained by the hydroxyl bonding between the metal oxide promoter and the silane grouping agent on the epoxy substrate, which contributes a greater adhesion strength compared to the polymer adhesion promoter. Hypotheses of the physical and chemical functions of both adhesion promoters are described in detail.
Infineon Technologies (Malaysia) Sdn Bhd (56645-D), Melaka Operations, Free Trade Zone, Batu Berendam, Melaka, Malaysia; Department of Electrical, Electronic & Systems Engineering, Faculty of Engineering & Built Environment, Universiti Kebangsaan Malaysia, Bangi, Selangor, Malaysia.
Lai Chin
LC
Yung
Infineon Technologies (Malaysia) Sdn Bhd (56645-D), Melaka Operations, Free Trade Zone, Batu Berendam, Melaka, Malaysia.
Cheong Choke
CC
Fei
Department of Electrical, Electronic & Systems Engineering, Faculty of Engineering & Built Environment, Universiti Kebangsaan Malaysia, Bangi, Selangor, Malaysia.
Js
J
Mandeep
Department of Electrical, Electronic & Systems Engineering, Faculty of Engineering & Built Environment, Universiti Kebangsaan Malaysia, Bangi, Selangor, Malaysia.
Huda
H
Binti Abdullah
Department of Biomedical Engineering, Faculty of Engineering, University of Malaya, Kuala Lumpur, Malaysia.
Lai Khin
LK
Wee
D004581:Electronics; D007281:Ink; D053768:Metal Nanoparticles / Q000737:chemistry*; D008670:Metals / Q000737:chemistry; D008855:Microscopy, Electron, Scanning; D010087:Oxides / Q000737:chemistry; D011108:Polymers; D011208:Powders; D012666:Semiconductors; D012821:Silanes / Q000737:chemistry; D018030:Silver Compounds / Q000737:chemistry*; D012997:Solvents; D013499:Surface Properties; D013696:Temperature
D008670:Metals; D010087:Oxides; D011108:Polymers; D011208:Powders; D012821:Silanes; D018030:Silver Compounds; D012997:Solvents