title: High-density soft-matter electronics with micron-scale line width.
abstract: A method to produce soft and stretchable microelectronics composed of a liquid-phase Gallium-Indium alloy with micron-scale circuit features is introduced. Microchannels are molded onto the surface of a poly(dimethylsiloxane) (PDMS) elastomer and filled with EGaIn using a micro-transfer deposition step that exploits the unique wetting properties of EGaIn in air. The liquid-filled channels function as stretchable circuit wires or capacitor electrodes with a 2 μm linewidth and 1 μm spacing.
authors.affiliation: Carnegie Mellon University, Mechanical Engineering Department, 5000 Forbes Avenue, Scaife Hall, Pittsburgh, PA, 15213, USA.
authors.forename: B Arda
authors.initials: BA
authors.lastname: Gozen
authors.forename: Arya
authors.initials: A
authors.lastname: Tabatabai
authors.forename: O Burak
authors.initials: OB
authors.lastname: Ozdoganlar
authors.forename: Carmel
authors.initials: C
authors.lastname: Majidi
keywords: eutectic gallium indium; liquid phase micro-electronics; micro-transfer printing; soft electronics; stretchable electronics