title: Highly conductive copper nano/microparticles ink via flash light sintering for printed electronics.
abstract: In this study, the size effect of copper particles on the flash light sintering of copper (Cu) ink was investigated using Cu nanoparticles (20-50 nm diameter) and microparticles (2 μm diameter). Also, the mixed Cu nano-/micro-inks were fabricated, and the synergetic effects between the Cu nano-ink and micro-ink on flash light sintering were assessed. The ratio of nanoparticles to microparticles in Cu ink and the several flash light irradiation conditions (irradiation energy density, pulse number, on-time, and off-time) were optimized to obtain high conductivity of Cu films. In order to precisely monitor the milliseconds-long flash light sintering process, in situ monitoring of electrical resistance and temperature changes of Cu films was conducted during the flash light irradiation using a real-time Wheatstone bridge electrical circuit, thermocouple-based circuit, and a high-rate data acquisition system. Also, several microscopic and spectroscopic characterization techniques such as scanning electron microscopy, x-ray diffraction, x-ray photoelectron spectroscopy, and Fourier transform infrared spectroscopy were used to characterize the flash light sintered Cu nano-/micro-films. In addition, the sheet resistance of Cu film was measured using a four-point probe method. This work revealed that the optimal ratio of nanoparticles to microparticles is 50:50 wt%, and the optimally fabricated and flash light sintered Cu nano-/micro-ink films have the lowest resistivity (80 μΩ cm) among nano-ink, micro-ink, or nano-micro mixed films.
authors.affiliation: Department of Mechanical Engineering, Hanyang University, Haengdang-dong, Seongdong-gu, Seoul 133-791, Korea.
authors.forename: Sung-Jun
authors.initials: SJ
authors.lastname: Joo
authors.forename: Hyun-Jun
authors.initials: HJ
authors.lastname: Hwang
authors.forename: Hak-Sung
authors.initials: HS
authors.lastname: Kim