title: Analysis of glass-reinforced epoxy material for radio frequency resonator.
abstract: A radio frequency (RF) resonator using glass-reinforced epoxy material for C and X band is proposed in this paper. Microstrip line technology for RF over glass-reinforced epoxy material is analyzed. Coupling mechanism over RF material and parasitic coupling performance is explained utilizing even and odd mode impedance with relevant equivalent circuit. Babinet's principle is deployed to explicate the circular slot ground plane of the proposed resonator. The resonator is designed over four materials from different backgrounds which are glass-reinforced epoxy, polyester, gallium arsenide (GaAs), and rogers RO 4350B. Parametric studies and optimization algorithm are applied over the geometry of the microstrip resonator to achieve dual band response for C and X band. Resonator behaviors for different materials are concluded and compared for the same structure. The final design is fabricated over glass-reinforced epoxy material. The fabricated resonator shows a maximum directivity of 5.65 dBi and 6.62 dBi at 5.84 GHz and 8.16 GHz, respectively. The lowest resonance response is less than -20 dB for C band and -34 dB for X band. The resonator is prototyped using LPKF (S63) drilling machine to study the material behavior.
authors: Institute of Space Science (ANGKASA), 43600 UKM Bangi, Malaysia ; Department of Electrical, Electronic and Systems Engineering, Universiti Kebangsaan Malaysia, 43600 UKM Bangi, Malaysia.
authors: M R
authors: 0000-0001-9715-4652
authors: MR
authors: Zaman
authors: Department of Electrical, Electronic and Systems Engineering, Universiti Kebangsaan Malaysia, 43600 UKM Bangi, Malaysia.
authors: M T
authors: MT
authors: Islam
authors: Department of Electrical, Electronic and Systems Engineering, Universiti Kebangsaan Malaysia, 43600 UKM Bangi, Malaysia.
authors: N
authors: N
authors: Misran
authors: Institute of Space Science (ANGKASA), 43600 UKM Bangi, Malaysia.
authors: Baharudin
authors: B
authors: Yatim
mesh_terms: D003198:Computer Simulation; D017076:Computer-Aided Design; D004581:Electronics / Q000295:instrumentation*; D004853:Epoxy Resins / Q000737:chemistry*; D004867:Equipment Design; D019544:Equipment Failure Analysis; D005898:Glass / Q000737:chemistry*; D008422:Materials Testing; D055617:Micro-Electrical-Mechanical Systems / Q000295:instrumentation*; D008872:Microwaves; D008962:Models, Theoretical; D011846:Radio Waves; D013685:Telecommunications / Q000295:instrumentation*
chemical_list: D004853:Epoxy Resins