title: Elastomeric thermal interface materials with high through-plane thermal conductivity from carbon fiber fillers vertically aligned by electrostatic flocking.
abstract: Electrostatic flocking is applied to create an array of aligned carbon fibers from which an elastomeric thermal interface material (TIM) can be fabricated with a high through-plane thermal conductivity of 23.3 W/mK. A high thermal conductivity can be achieved with a significantly low filler level (13.2 wt%). As a result, this material retains the intrinsic properties of the matrix, i.e., elastomeric behavior.
authors.affiliation: Technology Research Association for Single Wall Carbon Nanotubes (TASC), 1-1-1 Higashi, Tsukuba, Ibaraki, 305-8565, Japan.
authors.forename: Kojiro
authors.initials: K
authors.lastname: Uetani
authors.forename: Seisuke
authors.initials: S
authors.lastname: Ata
authors.forename: Shigeki
authors.initials: S
authors.lastname: Tomonoh
authors.forename: Takeo
authors.initials: T
authors.lastname: Yamada
authors.forename: Motoo
authors.initials: M
authors.lastname: Yumura
authors.forename: Kenji
authors.initials: K
authors.lastname: Hata
keywords: electrostatic flocking; thermal interface materials; through-plane thermal conductivity; vertically aligned carbon fibers