title: Surface and thickness profile measurement of a transparent film by three-wavelength vertical scanning interferometry.
abstract: We have developed a novel areal film thickness and topography measurement method using three-wavelength interferometry. The method simultaneously estimates the profiles of the front and back surfaces and the thickness distribution of a transparent film by model-based separation of two overlapped signals in an interferogram. The validity of the proposed method is demonstrated using computer simulations and actual experiments.
authors.forename: Katsuichi
authors.initials: K
authors.lastname: Kitagawa