title: Hong Kong: an R&D hub in Asia for materials science and engineering.
authors.forename: Zijian
authors.initials: Z
authors.lastname: Zheng
authors.forename: Jianfang
authors.initials: J
authors.lastname: Wang
authors.forename: Vivian Wing-Wah
authors.initials: VW
authors.lastname: Yam
authors.forename: Wenjun
authors.initials: W
authors.lastname: Zhang
authors.forename: Ben Zhong
authors.initials: BZ
authors.lastname: Tang
authors.forename: Ricky M S
authors.initials: RM
authors.lastname: Wong
mesh_terms: D004738:Engineering; D006723:Hong Kong; D049329:Nanostructures; D012106:Research; D013784:Textiles; D014495:Universities