title: Enhanced pathway efficiency of Saccharomyces cerevisiae by introducing thermo-tolerant devices.
abstract: In this study, thermo-tolerant devices consisting of heat shock genes from thermophiles were designed and introduced into Saccharomyces cerevisiae for improving its thermo-tolerance. Among ten engineered thermo-tolerant yeasts, T.te-TTE2469, T.te-GroS2 and T.te-IbpA displayed over 25% increased cell density and 1.5-4-fold cell viability compared with the control. Physiological characteristics of thermo-tolerant strains revealed that better cell wall integrity, higher trehalose content and enhanced metabolic energy were preserved by thermo-tolerant devices. Engineered thermo-tolerant strain was used to investigate the impact of thermo-tolerant device on pathway efficiency by introducing β-amyrin synthesis pathway, showed 28.1% increased β-amyrin titer, 28-35°C broadened growth temperature range and 72h shortened fermentation period. The results indicated that implanting heat shock proteins from thermophiles to S. cerevisiae would be an efficient approach to improve its thermo-tolerance.
authors.affiliation: School of Chemical Engineering, Tianjin University, Tianjin 300072, China.
authors.forename: Yueqin
authors.initials: Y
authors.lastname: Liu
authors.affiliation: School of Life Science, Beijing Institute of Technology, Beijing 100081, China.
authors.forename: Genli
authors.initials: G
authors.lastname: Zhang
authors.affiliation: School of Life Science, Beijing Institute of Technology, Beijing 100081, China.
authors.forename: Huan
authors.initials: H
authors.lastname: Sun
authors.affiliation: School of Life Science, Beijing Institute of Technology, Beijing 100081, China.
authors.forename: Xiangying
authors.initials: X
authors.lastname: Sun
authors.affiliation: School of Life Science, Beijing Institute of Technology, Beijing 100081, China.
authors.forename: Nisi
authors.initials: N
authors.lastname: Jiang
authors.affiliation: School of Life Science, Beijing Institute of Technology, Beijing 100081, China.
authors.forename: Aamir
authors.initials: A
authors.lastname: Rasool
authors.affiliation: Tsinghua University, Beijing 100084, China.
authors.forename: Zhanglin
authors.initials: Z
authors.lastname: Lin
authors.affiliation: School of Chemical Engineering, Tianjin University, Tianjin 300072, China; School of Life Science, Beijing Institute of Technology, Beijing 100081, China. Electronic address: lichun@bit.edu.cn.
authors.forename: Chun
authors.initials: C
authors.lastname: Li
mesh_terms: D000222:Adaptation, Physiological / Q000235:genetics*; D000704:Analysis of Variance; D053898:Biosynthetic Pathways / Q000235:genetics* / Q000502:physiology; D002470:Cell Survival / Q000502:physiology; D003224:Congo Red; D005818:Genetic Engineering / Q000379:methods*; D006360:Heat-Shock Proteins / Q000235:genetics*; D006358:Hot Temperature; D009828:Oleanolic Acid / Q000031:analogs & derivatives / Q000096:biosynthesis; D016133:Polymerase Chain Reaction; D012441:Saccharomyces cerevisiae / Q000235:genetics / Q000502:physiology*; D014199:Trehalose / Q000378:metabolism
chemical_list: D006360:Heat-Shock Proteins; D003224:Congo Red; D009828:Oleanolic Acid; D014199:Trehalose; C036380:beta-amyrin
keywords: Heat shock proteins (HSPs); S. cerevisiae; Thermo-tolerance; Thermo-tolerant devices; Thermophiles