title: Thermal cycling life prediction of Sn-3.0Ag-0.5Cu solder joint using type-I censored data.
abstract: Because solder joint interconnections are the weaknesses of microelectronic packaging, their reliability has great influence on the reliability of the entire packaging structure. Based on an accelerated life test the reliability assessment and life prediction of lead-free solder joints using Weibull distribution are investigated. The type-I interval censored lifetime data were collected from a thermal cycling test, which was implemented on microelectronic packaging with lead-free ball grid array (BGA) and fine-pitch ball grid array (FBGA) interconnection structures. The number of cycles to failure of lead-free solder joints is predicted by using a modified Engelmaier fatigue life model and a type-I censored data processing method. Then, the Pan model is employed to calculate the acceleration factor of this test. A comparison of life predictions between the proposed method and the ones calculated directly by Matlab and Minitab is conducted to demonstrate the practicability and effectiveness of the proposed method. At last, failure analysis and microstructure evolution of lead-free solders are carried out to provide useful guidance for the regular maintenance, replacement of substructure, and subsequent processing of electronic products.
authors.affiliation: School of Mechanical, Electronic and Industrial Engineering, University of Electronic Science and Technology of China, No. 2006, Xiyuan Avenue, West Hi-Tech Zone, Chengdu, Sichuan 611731, China.
authors.forename: Jinhua
authors.initials: J
authors.lastname: Mi
authors.affiliation: School of Mechanical, Electronic and Industrial Engineering, University of Electronic Science and Technology of China, No. 2006, Xiyuan Avenue, West Hi-Tech Zone, Chengdu, Sichuan 611731, China.
authors.forename: Yan-Feng
authors.identifier: 0000-0002-9121-1465
authors.initials: YF
authors.lastname: Li
authors.affiliation: School of Mechanical, Electronic and Industrial Engineering, University of Electronic Science and Technology of China, No. 2006, Xiyuan Avenue, West Hi-Tech Zone, Chengdu, Sichuan 611731, China.
authors.forename: Yuan-Jian
authors.initials: YJ
authors.lastname: Yang
authors.affiliation: School of Mechanical, Electronic and Industrial Engineering, University of Electronic Science and Technology of China, No. 2006, Xiyuan Avenue, West Hi-Tech Zone, Chengdu, Sichuan 611731, China.
authors.forename: Weiwen
authors.identifier: 0000-0001-9535-9187
authors.initials: W
authors.lastname: Peng
authors.affiliation: School of Mechanical, Electronic and Industrial Engineering, University of Electronic Science and Technology of China, No. 2006, Xiyuan Avenue, West Hi-Tech Zone, Chengdu, Sichuan 611731, China.
authors.forename: Hong-Zhong
authors.initials: HZ
authors.lastname: Huang
mesh_terms: D003300:Copper / Q000737:chemistry*; D004581:Electronics; D019544:Equipment Failure Analysis; D006358:Hot Temperature; D008422:Materials Testing; D008855:Microscopy, Electron, Scanning; D008956:Models, Chemical; D012834:Silver / Q000737:chemistry*; D017971:Tin Compounds / Q000737:chemistry*
chemical_list: D017971:Tin Compounds; D012834:Silver; D003300:Copper