title: Thermal conductivity improvement of surface-enhanced polyetherimide (PEI) composites using polyimide-coated h-BN particles.
abstract: In this study, we investigated the thermal conductivities and mechanical properties of polyetherimide (PEI) composites using polyimide (PI)-coated h-BN (PI-BN) particles. We found that PI-coated h-BN effectively increased adhesion with the PEI matrix, imparting enhanced mechanical and thermal stability and thermal conductivity with increasing BN content. The thermal conductivity of the PEI composite containing 60 wt% PI-BN was 3.3 W m(-1) K(-1), while the thermal conductivity of the PEI/BN composite without modification was 2.6 W m(-1) K(-1). The PEI/PI-BN composites show higher impact strengths than the PEI/BN composites because of less BN particle agglomeration and good wettability between PEI and h-BN. The results indicate that the PI-coated BN incorporated into the PEI matrix effectively enhances the thermal conductivity and mechanical properties of the PEI composites.
authors.affiliation: Advanced Functional Materials Research Group, Korea Research Institute of Chemical Technology, Daejeon 305-600, Republic of Korea. yjyoo@krict.re.kr.
authors.forename: Hoing Lae
authors.initials: HL
authors.lastname: Lee
authors.forename: O Hwan
authors.initials: OH
authors.lastname: Kwon
authors.forename: Sung Min
authors.initials: SM
authors.lastname: Ha
authors.forename: Byoung Gak
authors.initials: BG
authors.lastname: Kim
authors.forename: Yong Seok
authors.initials: YS
authors.lastname: Kim
authors.forename: Jong Chan
authors.initials: JC
authors.lastname: Won
authors.forename: Jooheon
authors.initials: J
authors.lastname: Kim
authors.forename: Jong Han
authors.initials: JH
authors.lastname: Choi
authors.forename: Youngjae
authors.initials: Y
authors.lastname: Yoo