title: Effect of grain orientations of Cu seed layers on the growth of <111>-oriented nanotwinned Cu.
abstract: We investigate the growth of Cu films on two different Cu seed layers: one with regular <111>-oriented grains and the other with very strong <111>-preferred orientation. It is found that densely-packed nanotwinned Cu (nt-Cu) can be grown by pulsed electroplating on the strong <111>-oriented Cu seed layer without a randomly-oriented transition layer between the nt-Cu and the Cu seed layer. The electroplated nt-Cu grow almost epitaxially on the seed layer and formed <111>-oriented columnar structures. However, with the regular <111>-oriented Cu seed, there is a randomly-oriented transition layer between the nt-Cu and the regular <111>-oriented Cu seed. The results indicate that the seed layer plays a crucial role on the regularity of <111>-oriented nanotwinned Cu.
authors.affiliation: Department of Materials Science and Engineering, National Chiao-Tung University, Hsinchu, 30010 Taiwan (ROC).
authors.forename: Chien-Min
authors.initials: CM
authors.lastname: Liu
authors.affiliation: Department of Materials Science and Engineering, National Chiao-Tung University, Hsinchu, 30010 Taiwan (ROC).
authors.forename: Han-Wen
authors.initials: HW
authors.lastname: Lin
authors.affiliation: Department of Materials Science and Engineering, National Chiao-Tung University, Hsinchu, 30010 Taiwan (ROC).
authors.forename: Chia-Ling
authors.initials: CL
authors.lastname: Lu
authors.affiliation: Department of Materials Science and Engineering, National Chiao-Tung University, Hsinchu, 30010 Taiwan (ROC).
authors.forename: Chih
authors.initials: C
authors.lastname: Chen