title: Design and fabrication of novel stretchable device arrays on a deformable polymer substrate with embedded liquid-metal interconnections.
abstract: Stretchable devices are fabricated on a newly designed deformable substrate. Active devices attached on the stiff islands are electrically connected by an embedded EGaIn interconnection, which ensures protection from external damage. In this structure, the local strain in the active device area is estimated to be less than 1% under applied strain of 30% by analysis of the strain distribution using the finite element method.
authors.affiliation: Department of Chemical and Biological Engineering, Korea University, Seoul, 136-701, Korea.
authors.forename: Jangyeol
authors.initials: J
authors.lastname: Yoon
authors.forename: Soo Yeong
authors.initials: SY
authors.lastname: Hong
authors.forename: Yein
authors.initials: Y
authors.lastname: Lim
authors.forename: Seung-Jung
authors.initials: SJ
authors.lastname: Lee
authors.forename: Goangseup
authors.initials: G
authors.lastname: Zi
authors.forename: Jeong Sook
authors.initials: JS
authors.lastname: Ha
keywords: deformable substrates; double integration; embedded interconnections; stretchable device arrays