title: Experimental study on active cooling systems used for thermal management of high-power multichip light-emitting diodes.
abstract: The objective of this study was to develop suitable cooling systems for high-power multichip LEDs. To this end, three different active cooling systems were investigated to control the heat generated by the powering of high-power multichip LEDs in two different configurations (30 and 2 × 15 W). The following cooling systems were used in the study: an integrated multi-fin heat sink design with a fan, a cooling system with a thermoelectric cooler (TEC), and a heat pipe cooling device. According to the results, all three systems were observed to be sufficient for cooling high-power LEDs. Furthermore, it was observed that the integrated multifin heat sink design with a fan was the most efficient cooling system for a 30 W high-power multichip LED. The cooling system with a TEC and 46 W input power was the most efficient cooling system for 2 × 15 W high-power multichip LEDs.
authors.affiliation: Department of Mechanical Engineering, Erzincan University, 24100 Erzincan, Turkey.
authors.forename: Mehmet
authors.identifier: 0000-0002-0607-4735
authors.initials: M
authors.lastname: Kaya
mesh_terms: D000465:Algorithms; D004867:Equipment Design; D006358:Hot Temperature; D008029:Lighting / Q000295:instrumentation*; D008962:Models, Theoretical; D012666:Semiconductors