title: Flexible nanoscale high-performance FinFETs.
abstract: With the emergence of the Internet of Things (IoT), flexible high-performance nanoscale electronics are more desired. At the moment, FinFET is the most advanced transistor architecture used in the state-of-the-art microprocessors. Therefore, we show a soft-etch based substrate thinning process to transform silicon-on-insulator (SOI) based nanoscale FinFET into flexible FinFET and then conduct comprehensive electrical characterization under various bending conditions to understand its electrical performance. Our study shows that back-etch based substrate thinning process is gentler than traditional abrasive back-grinding process; it can attain ultraflexibility and the electrical characteristics of the flexible nanoscale FinFET show no performance degradation compared to its rigid bulk counterpart indicating its readiness to be used for flexible high-performance electronics.
authors.affiliation: Integrated Nanotechnology Lab, King Abdullah University of Science and Technology , Thuwal, Makkah 23955-6900, Saudi Arabia.
authors.forename: Galo A
authors.initials: GA
authors.lastname: Torres Sevilla
authors.forename: Mohamed T
authors.initials: MT
authors.lastname: Ghoneim
authors.forename: Hossain
authors.initials: H
authors.lastname: Fahad
authors.forename: Jhonathan P
authors.initials: JP
authors.lastname: Rojas
authors.forename: Aftab M
authors.initials: AM
authors.lastname: Hussain
authors.forename: Muhammad Mustafa
authors.initials: MM
authors.lastname: Hussain
keywords: FinFETs; flexible silicon; high-performance flexible electronics