title: Patterned adhesive enables construction of nonplanar three-dimensional paper microfluidic circuits.
abstract: This article discusses the fabrication of planar and nonplanar 3D paper microfluidic circuits through the use of patterned spray adhesive application and origami techniques. The individual paper layers are held together via semi-permanent adhesive bonds without the need for external clamps. Semi-permanent bonds accommodate the repeated folding and unfolding required by complex origami device structures and allow the device to be unfolded post-use to view internally displayed results. Combinations of adhesive patterns and fluid channel widths were identified that did not prevent the fluid from traveling between layers and through the entire circuit. Further, this method was extended to nonplanar 3D paper microfluidic circuits, demonstrated via multi-fluid wicking within a modified origami peacock. Such nonplanar 3D paper microfluidic circuits are expected to offer an entirely new platform for exploring new designs and functions of paper analytical devices.
authors.affiliation: Department of Mechanical Engineering, University of California, Riverside, Riverside, CA 92521, USA. htsutsui@engr.ucr.edu.
authors.forename: Brent
authors.initials: B
authors.lastname: Kalish
authors.forename: Hideaki
authors.initials: H
authors.lastname: Tsutsui
mesh_terms: D000269:Adhesives / Q000737:chemistry*; D004867:Equipment Design; D046210:Microfluidic Analytical Techniques / Q000295:instrumentation*; D010209:Paper
chemical_list: D000269:Adhesives