title: Dry-film polymer waveguide for silicon photonics chip packaging.
abstract: Polymer waveguide made by dry film process is demonstrated for silicon photonics chip packaging. With 8 μm × 11.5 μm core waveguide, little penalty is observed up to 25 Gbps before or after the light propagate through a 10-km long single-mode fiber (SMF). Coupling loss to SMF is 0.24 dB and 1.31 dB at the polymer waveguide input and output ends, respectively. Alignment tolerance for 0.5 dB loss increase is +/- 1.0 μm along both vertical and horizontal directions for the coupling from the polymer waveguide to SMF. The dry-film polymer waveguide demonstrates promising performance for silicon photonics chip packaging used in next generation optical multi-chip module.
authors.forename: Hsiang-Han
authors.initials: HH
authors.lastname: Hsu
authors.forename: Shigeru
authors.initials: S
authors.lastname: Nakagawa
mesh_terms: D004867:Equipment Design; D008027:Light; D055095:Optics and Photonics / Q000295:instrumentation*; D011108:Polymers; D019064:Product Packaging / Q000295:instrumentation*; D012031:Refractometry / Q000295:instrumentation*; D012542:Scattering, Radiation; D012825:Silicon
chemical_list: D011108:Polymers; D012825:Silicon