title: Novel real-time temperature diagnosis of conventional hot-embossing process using an ultrasonic transducer.
abstract: This paper presents an integrated high temperature ultrasonic transducer (HTUT) on a sensor insert and its application for real-time diagnostics of the conventional hot embossing process to fabricate V-cut patterns. The sensor was directly deposited onto the sensor insert of the hot embossing mold by using a sol-gel spray technique. It could operate at temperatures higher than 400 °C and uses an ultrasonic pulse-echo technique. The ultrasonic velocity could indicate the three statuses of the hot embossing process and also evaluate the replication of V-cut patterns on a plastic plate under various processing conditions. The progression of the process, including mold closure, plastic plate softening, cooling and plate detachment inside the mold, was clearly observed using ultrasound. For an ultrasonic velocity range from 2197.4 to 2435.9 m/s, the height of the V-cut pattern decreased from 23.0 to 3.2 µm linearly, with a ratio of -0.078 µm/(m/s). The incompleteness of the replication of the V-cut patterns could be indirectly observed by the ultrasonic signals. This study demonstrates the effectiveness of the ultrasonic sensors and technology for diagnosing the replicating condition of microstructures during the conventional hot embossing process.
authors.affiliation: Department of Energy and Refrigerating Air-Conditioning Engineering, National Taipei University of Technology, Taipei, Taiwan. newmanch@ntut.edu.tw.
authors.forename: Chin-Chi
authors.initials: CC
authors.lastname: Cheng
authors.affiliation: Department of Mechanical Engineering, National Taiwan University, Taipei, Taiwan. syyang@ntu.edu.tw.
authors.forename: Sen-Yeu
authors.initials: SY
authors.lastname: Yang
authors.affiliation: Department of Energy and Refrigerating Air-Conditioning Engineering, National Taipei University of Technology, Taipei, Taiwan. f11167@ntut.edu.tw.
authors.forename: Dasheng
authors.initials: D
authors.lastname: Lee