title: Silicon photonics packaging with lateral fiber coupling to apodized grating coupler embedded circuit.
abstract: We report a novel lateral packaging approach using laser welding technique with angle polished fiber coupling to grating coupler embedded silicon photonic circuit. Measurements show the relax alignment tolerance for fiber packaging process. The packaging excess loss of 1.2 dB is achieved. The use of angle polished fiber for lateral fiber coupling enables an alternative way for cost-effective deployment of silicon photonics packaging in telecommunication systems.
authors.forename: Chao
authors.initials: C
authors.lastname: Li
authors.forename: Koh Sing
authors.initials: KS
authors.lastname: Chee
authors.forename: Jifang
authors.initials: J
authors.lastname: Tao
authors.forename: Huijuan
authors.initials: H
authors.lastname: Zhang
authors.forename: Mingbin
authors.initials: M
authors.lastname: Yu
authors.forename: G Q
authors.initials: GQ
authors.lastname: Lo