title: Quartz resonator assembling with TSV interposer using polymer sealing or metal bonding.
abstract: This paper presents one wafer level packaging approach of quartz resonator based on through-silicon via (TSV) interposer with metal or polymer bonding sealing of frequency components. The proposed silicon-based package of quartz resonator adopts several three-dimensional (3D) core technologies, such as Cu TSVs, sealing bonding, and wafer thinning. It is different from conventional quartz resonator using ceramic-based package. With evaluation of mechanical structure design and package performances, this quartz resonator with advanced silicon-based package shows great manufacturability and excellent performance to replace traditional metal lid with ceramic-based interposer fabrication approach.
authors.affiliation: Department of Electronics Engineering, National Chiao Tung University, Hsinchu 300, Taiwan.
authors.forename: Jian-Yu
authors.initials: JY
authors.lastname: Shih
authors.affiliation: TXC Corporation, Taoyuan 324, Taiwan.
authors.forename: Yen-Chi
authors.initials: YC
authors.lastname: Chen
authors.affiliation: TXC Corporation, Taoyuan 324, Taiwan.
authors.forename: Chih-Hung
authors.initials: CH
authors.lastname: Chiu
authors.affiliation: TXC Corporation, Taoyuan 324, Taiwan.
authors.forename: Chung-Lun
authors.initials: CL
authors.lastname: Lo
authors.affiliation: TXC Corporation, Taoyuan 324, Taiwan.
authors.forename: Chi-Chung
authors.initials: CC
authors.lastname: Chang
authors.affiliation: Department of Electronics Engineering, National Chiao Tung University, Hsinchu 300, Taiwan.
authors.forename: Kuan-Neng
authors.initials: KN
authors.lastname: Chen
keywords: Sealing bonding; Three-dimensional (3D) integration; Through-silicon via (TSV); Wafer thinning