title: Demonstration of strong near-field radiative heat transfer between integrated nanostructures.
abstract: Near-field heat transfer recently attracted growing interest but was demonstrated experimentally only in macroscopic systems. However, several projected applications would be relevant mostly in integrated nanostructures. Here we demonstrate a platform for near-field heat transfer on-chip and show that it can be the dominant thermal transport mechanism between integrated nanostructures, overcoming background substrate conduction and the far-field limit (by factors 8 and 7, respectively). Our approach could enable the development of active thermal control devices such as thermal rectifiers and transistors.
authors.affiliation: School of Electrical and Computer Engineering, Cornell University , Ithaca, New York 14853, United States.
authors.forename: Raphael
authors.initials: R
authors.lastname: St-Gelais
authors.forename: Biswajeet
authors.initials: B
authors.lastname: Guha
authors.forename: Linxiao
authors.initials: L
authors.lastname: Zhu
authors.forename: Shanhui
authors.initials: S
authors.lastname: Fan
authors.forename: Michal
authors.initials: M
authors.lastname: Lipson
keywords: Thermal transport; microelectromechanical systems (MEMS); near-field radiation; surface phonon-polariton; thermal radiation