title: Solvent-free fabrication of thermally conductive insulating epoxy composites with boron nitride nanoplatelets as fillers.
abstract: A solvent-free method for the fabrication of thermally conductive epoxy-boron nitride (BN) nanoplatelet composite material is developed in this study. By this method, polymer composites with nearly any filler fractions can be easily fabricated. The maximum thermal conductivity reaches 5.24 W/mK, which is 1,600% improvement in comparison with that of pristine epoxy material. In addition, the as-fabricated samples exhibit excellent overall performances with great mechanical property and thermal stability well preserved.
authors.affiliation: Department of Physics and Materials Science, City University of Hong Kong, 83 Tat Chee Avenue, Kowloon, Hong Kong, People's Republic of China.
authors.forename: Zifeng
authors.initials: Z
authors.lastname: Wang
authors.affiliation: Department of Physics and Materials Science, City University of Hong Kong, 83 Tat Chee Avenue, Kowloon, Hong Kong, People's Republic of China.
authors.forename: Yuqiao
authors.initials: Y
authors.lastname: Fu
authors.affiliation: Department of Physics and Materials Science, City University of Hong Kong, 83 Tat Chee Avenue, Kowloon, Hong Kong, People's Republic of China.
authors.forename: Wenjun
authors.initials: W
authors.lastname: Meng
authors.affiliation: Department of Physics and Materials Science, City University of Hong Kong, 83 Tat Chee Avenue, Kowloon, Hong Kong, People's Republic of China ; Shenzhen Research Institute, City University of Hong Kong, Shenzhen, People's Republic of China.
authors.forename: Chunyi
authors.initials: C
authors.lastname: Zhi
keywords: Boron nitride nanoplatelets; Epoxy composites; Solvent-free fabrication; Thermal conductivity