title: Ultrastretchable and flexible copper interconnect-based smart patch for adaptive thermotherapy.
abstract: Unprecedented 800% stretchable, non-polymeric, widely used, low-cost, naturally rigid, metallic thin-film copper (Cu)-based flexible and non-invasive, spatially tunable, mobile thermal patch with wireless controllability, adaptability (tunes the amount of heat based on the temperature of the swollen portion), reusability, and affordability due to low-cost complementary metal oxide semiconductor (CMOS) compatible integration.
authors.affiliation: Integrated Nanotechnology Laboratory, Computer Electrical Mathematical Science and Engineering Division, King Abdullah University of Science and Technology (KAUST), Thuwal, Saudi Arabia.
authors.forename: Aftab M
authors.initials: AM
authors.lastname: Hussain
authors.forename: Ernesto Byas
authors.initials: EB
authors.lastname: Lizardo
authors.forename: Galo A
authors.initials: GA
authors.lastname: Torres Sevilla
authors.forename: Joanna M
authors.initials: JM
authors.lastname: Nassar
authors.forename: Muhammad M
authors.initials: MM
authors.lastname: Hussain
mesh_terms: D000328:Adult; D003300:Copper / Q000737:chemistry*; D004867:Equipment Design; D005542:Forearm / Q000502:physiology; D006801:Humans; D006979:Hyperthermia, Induced / Q000295:instrumentation*; D000068997:Smartphone / Q000295:instrumentation*; D013696:Temperature
chemical_list: D003300:Copper
keywords: copper; flexibility; pain management; stretchability; thermal patches