title: Elevation of the temperature of liquid films caused by rapid rupturing.
abstract: Although there have been several experimental and numerical works on rapidly rupturing films, measurement of the spatial-temporal temperature during rupturing processes is lacking. Using molecular dynamics simulations, we show that a rupturing film with nanometer thickness generates a non-negligible temperature increase. We demonstrate a correlation between the rupture velocity, the temperature increase, and the initial film thickness. Our findings show that the temperature increase causes changes to the physical properties, which affect the film-rupturing behavior.
authors.affiliation: Department of Mechanical Engineering, Faculty of Science and Technology, Tokyo University of Science, 2641 Yamazaki, Noda, Chiba 278-8510, Japan.
authors.forename: Susumu
authors.initials: S
authors.lastname: Kono
authors.affiliation: Department of Mechanical Engineering, Faculty of Science and Technology, Tokyo University of Science, 2641 Yamazaki, Noda, Chiba 278-8510, Japan and Research Institute of Science & Technology, Tokyo University of Science, 2641 Yamazaki, Noda, Chiba 278-8510, Japan.
authors.forename: Toshihiro
authors.initials: T
authors.lastname: Kaneko
authors.affiliation: Department of Mechanical Engineering, Faculty of Science and Technology, Tokyo University of Science, 2641 Yamazaki, Noda, Chiba 278-8510, Japan and Research Institute of Science & Technology, Tokyo University of Science, 2641 Yamazaki, Noda, Chiba 278-8510, Japan.
authors.forename: Ichiro
authors.initials: I
authors.lastname: Ueno