title: [A study on the development of TMPT-contained trial dentin sealant].
abstract: OBJECTIVE
  To investigate the effect of resin curing system formulations of TMPT-contained trial dentin sealant on its bonding and polymerization properties.
  
  
  METHODS
  Commercially available Hybrid Coat (HyC) and previously trial TMPT-contained dentin sealant T33 as control groups, adjusting camphorquinone (CQ) content to make CQ trial dentin sealants. Their dentin shear bond strength was tested to find the strongest group named CQn as the next test substrate. N-phenylglycine (NPG) content of original sponges was adjusted to make NC trial sponges. Bond strength and degree of conversion of CQn were tested using each NC trial sponges. The data was analyzed by SPSS13.0 software package.
  
  
  RESULTS
  CQ3 showed the biggest bond strength in the group of CQ trial sealants of about 12.99 MPa. When CQ3 was used with every NPG trial sponges, NPG4.4 and NPG7.3 groups showed the statistically greatest bond strength of about 14.68 and 14.69 MPa (P<0.05). And NPG7.3 also showed the maximum degree of conversion of about 83.2%.
  
  
  CONCLUSIONS
  The bonding strength and degree of conversion of trial TMPT-contained dentin sealant were the biggest when molar ratio of CQ and NPG was 1:4.4 or 7.3, but the material properties need to be tested in subsequent experiments.
authors.affiliation: Stomatological Hospital of Xi'an Jiaotong University. Xi'an 710004; Ninth Hospital of Xi'an City. Xi'an 710054, Shaanxi Province, China.E-mail:zhouqin0529@126.com.
authors.forename: Qin
authors.initials: Q
authors.lastname: Zhou
authors.forename: Tong
authors.initials: T
authors.lastname: Lin
authors.forename: Wen-hong
authors.initials: WH
authors.lastname: Tan
authors.forename: Min
authors.initials: M
authors.lastname: Xiao
authors.forename: Yi
authors.initials: Y
authors.lastname: Lu
mesh_terms: D017438:Bisphenol A-Glycidyl Methacrylate; D001840:Dental Bonding; D003804:Dentin; D005998:Glycine / Q000031:analogs & derivatives; D008422:Materials Testing; D010895:Pit and Fissure Sealants; D019279:Resin Cements
chemical_list: D010895:Pit and Fissure Sealants; D019279:Resin Cements; C021316:N-phenylglycine; D017438:Bisphenol A-Glycidyl Methacrylate; D005998:Glycine