title: Control of cavity lifetime of 1.5 µm wafer-fused VCSELs by digital mirror trimming.
abstract: Digital chemical etching is used to trim the output mirror thickness of wafer-fused VCSELs emitting at a wavelength near 1.5µm. The fine control of the photon cavity lifetime thus achieved is employed to extract important device parameters and optimize the combination of the threshold current, output power, and direct current modulation characteristics. The fabrication process is compatible with industrial production and should help in improving device yield and in reducing manufacturing costs.
authors.forename: Dalila
authors.initials: D
authors.lastname: Ellafi
authors.forename: Valdimir
authors.initials: V
authors.lastname: Iakovlev
authors.forename: Alexei
authors.initials: A
authors.lastname: Sirbu
authors.forename: Grigore
authors.initials: G
authors.lastname: Suruceanu
authors.forename: Zlatco
authors.initials: Z
authors.lastname: Mickovic
authors.forename: Andrei
authors.initials: A
authors.lastname: Caliman
authors.forename: Alexandru
authors.initials: A
authors.lastname: Mereuta
authors.forename: Elyahou
authors.initials: E
authors.lastname: Kapon
mesh_terms: D017076:Computer-Aided Design; D004867:Equipment Design; D019544:Equipment Failure Analysis; D054023:Lasers, Semiconductor; D007909:Lenses; D012815:Signal Processing, Computer-Assisted / Q000295:instrumentation*; D014867:Water
chemical_list: D014867:Water