title: Surface relaxation of Cu(5 1 1).
abstract: The multilayer relaxation of the stepped Cu(5 1 1) surface has been studied by quantitative low-energy electron diffraction and analyzed using the CLEED program package. Relaxations with respect to the bulk interlayer spacing of 0.6934 Å are -9.5%, -10.4%, +8.2% and -1.8% for the first four interlayer spacings, respectively (negative sign corresponds to contraction). The relaxation sequence (- - + -…) is thus in agreement with the theoretical prediction. The deeper relaxations are damped in a non-uniform manner and the lateral relaxations are smaller than 2% of the lateral spacing. This result agrees well with theoretical studies of the same surface. The Pendry R-factor for the favored structure is 0.21.
authors.affiliation: Department of Mathematics and Physics, Lappeenranta University of Technology, PO Box 20 FIN-53851 Lappeenranta, Finland.
authors.forename: K
authors.initials: K
authors.lastname: Pussi
authors.forename: M
authors.initials: M
authors.lastname: Caragiu
authors.forename: K J
authors.initials: KJ
authors.lastname: Hanna
authors.forename: W
authors.initials: W
authors.lastname: Moritz
authors.forename: R D
authors.initials: RD
authors.lastname: Diehl