title: Ductile film delamination from compliant substrates using hard overlayers.
abstract: Flexible electronic devices call for copper and gold metal films to adhere well to polymer substrates. Measuring the interfacial adhesion of these material systems is often challenging, requiring the formulation of different techniques and models. Presented here is a strategy to induce well defined areas of delamination to measure the adhesion of copper films on polyimide substrates. The technique utilizes a stressed overlayer and tensile straining to cause buckle formation. The described method allows one to examine the effects of thin adhesion layers used to improve the adhesion of flexible systems.
authors: Erich Schmid Institute of Materials Science, Austrian Academy of Sciences, Austria.
authors: M J
authors: MJ
authors: Cordill
authors: Max-Plank-Insitut für Eisenforschung GmbH, Düsseldorf, Germany.
authors: V M
authors: VM
authors: Marx
authors: Max-Plank-Insitut für Eisenforschung GmbH, Düsseldorf, Germany.
authors: C
authors: C
authors: Kirchlechner
keywords: Adhesion; Fragmentation testing; Polymer substrates; Stressed overlayers; Thin films
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