title: A double-sided, single-chip integration scheme using through-silicon-via for neural sensing applications.
abstract: We present a new double-sided, single-chip monolithic integration scheme to integrate the CMOS circuits and MEMS structures by using through-silicon-via (TSV). Neural sensing applications were chosen as the implementation example. The proposed heterogeneous device integrates standard 0.18 μm CMOS technology, TSV and neural probe array into a compact single chip device. The neural probe array on the back-side of the chip is connected to the CMOS circuits on the front-side of the chip by using low-parasitic TSVs through the chip. Successful fabrication results and detailed characterization demonstrate the feasibility and performance of the neural probe array, TSV and readout circuitry. The fabricated device is 5 × 5 mm(2) in area, with 16 channels of 150 μm-in-length neural probe array on the back-side, 200 μm-deep TSV through the chip and CMOS circuits on the front-side. Each channel consists of a 5 × 6 probe array, 3 × 14 TSV array and a differential-difference amplifier (DDA) based analog front-end circuitry with 1.8 V supply, 21.88 μW power consumption, 108 dB CMRR and 2.56 μVrms input referred noise. In-vivo long term implantation demonstrated the feasibility of presented integration scheme after 7 and 58 days of implantation. We expect the conceptual realization can be extended for higher density recording array by using the proposed method.
authors: Department of Bioengineering, University of California in Los Angeles, Los Angeles, CA, 90095, USA.
authors: Chih-Wei
authors: CW
authors: Chang
authors: Lei-Chun
authors: LC
authors: Chou
authors: Po-Tsang
authors: PT
authors: Huang
authors: Shang-Lin
authors: SL
authors: Wu
authors: Shih-Wei
authors: SW
authors: Lee
authors: Ching-Te
authors: CT
authors: Chuang
authors: Kuan-Neng
authors: KN
authors: Chen
authors: Wei
authors: W
authors: Hwang
authors: Kuo-Hua
authors: KH
authors: Chen
authors: Chi-Tsung
authors: CT
authors: Chiu
authors: Ho-Ming
authors: HM
authors: Tong
authors: Jin-Chern
authors: JC
authors: Chiou
mesh_terms: D004567:Electrodes, Implanted; D056656:Lab-On-A-Chip Devices