title: Cu nanoparticles electrodeposited at liquid-liquid interfaces: a highly efficient catalyst for the hydrogen evolution reaction.
abstract: The electrochemical deposition of Cu nanoparticles with an average diameter of approximately 25-35 nm has been reported at liquid-liquid interfaces by using the organic-phase electron-donor decamethylferrocene (DMFc). The electrodeposited Cu nanoparticles display excellent catalytic activity for the hydrogen evolution reaction (HER); this is the first reported catalytic effect of Cu nanoparticles at liquid-liquid interfaces.
authors: Selcuk University, Department of Chemistry, 42031, Konya (Turkey), Fax: (+90) 332-241-0106.
authors: Emre
authors: E
authors: Aslan
authors: Imren Hatay
authors: IH
authors: Patir
authors: Mustafa
authors: M
authors: Ersoz
keywords: copper; hydrogen evolution; liquid-liquid interface; nanoparticles