title: UV-assisted modification and removal mechanism of a fluorocarbon polymer film on low-k dielectric trench structure.
abstract: In this study, we report the first chemical characterization of a plasma-deposited model fluoropolymer on low-k dielectric nanostructure and its decomposition in UV/O2 conditions. Carbonyl incorporation and progressive removal of fluorocarbon fragments from the polymer were observed with increasing UV (≥230 nm) irradiation under atmospheric conditions. A significant material loss was achieved after 300 s of UV treatment and a subsequent wet clean completely removed the initially insoluble fluoropolymer from the patterned nanostructures. A synergistic mechanism of UV light absorption by carbonyl chromophore and oxygen incorporation is proposed to account for the observed photodegradation of the fluoropolymer.
authors: Department of Chemistry, Interfacial Electrochemistry and Materials Research Lab, University of North Texas , Denton, Texas 76203, United States.
authors: Tamal
authors: T
authors: Mukherjee
authors: Seare A
authors: SA
authors: Berhe
authors: Arindom
authors: A
authors: Goswami
authors: Oliver
authors: O
authors: Chyan
authors: Kanwal Jit
authors: KJ
authors: Singh
authors: Ian
authors: I
authors: Brown
keywords: UV irradiation; fluorocarbon polymer; low-k dielectrics; photosensitization; postetch residue removal; singlet oxygen