title: Biodegradable elastomers and silicon nanomembranes/nanoribbons for stretchable, transient electronics, and biosensors.
abstract: Transient electronics represents an emerging class of technology that exploits materials and/or device constructs that are capable of physically disappearing or disintegrating in a controlled manner at programmed rates or times. Inorganic semiconductor nanomaterials such as silicon nanomembranes/nanoribbons provide attractive choices for active elements in transistors, diodes and other essential components of overall systems that dissolve completely by hydrolysis in biofluids or groundwater. We describe here materials, mechanics, and design layouts to achieve this type of technology in stretchable configurations with biodegradable elastomers for substrate/encapsulation layers. Experimental and theoretical results illuminate the mechanical properties under large strain deformation. Circuit characterization of complementary metal-oxide-semiconductor inverters and individual transistors under various levels of applied loads validates the design strategies. Examples of biosensors demonstrate possibilities for stretchable, transient devices in biomedical applications.
authors.affiliation: †KU-KIST Graduate School of Converging Science and Technology, Korea University, Seoul 136-701, Korea.
authors.forename: Suk-Won
authors.initials: SW
authors.lastname: Hwang
authors.affiliation: ‡Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801, United States.
authors.forename: Chi Hwan
authors.initials: CH
authors.lastname: Lee
authors.affiliation: §Department of Mechanical Engineering, Civil and Environmental Engineering, Center for Engineering and Health, and Skin Disease Research Center, Northwestern University, Evanston, Illinois 60208, United States.
authors.forename: Huanyu
authors.initials: H
authors.lastname: Cheng
authors.affiliation: ∥Department of Electrical, Computer, and Energy Engineering, University of Colorado, Boulder, Colorado 80309, United States.
authors.forename: Jae-Woong
authors.initials: JW
authors.lastname: Jeong
authors.affiliation: ‡Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801, United States.
authors.forename: Seung-Kyun
authors.initials: SK
authors.lastname: Kang
authors.affiliation: ‡Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801, United States.
authors.forename: Jae-Hwan
authors.initials: JH
authors.lastname: Kim
authors.affiliation: ⊥Department of Chemical and Biomolecular Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801, United States.
authors.forename: Jiho
authors.initials: J
authors.lastname: Shin
authors.affiliation: #Department of Biomedical Engineering, Northwestern University, Evanston, Illinois 60208, United States.
authors.forename: Jian
authors.initials: J
authors.lastname: Yang
authors.affiliation: ∇Institute of High Performance Computing, 1 Fusionopolis Way, #16-16 Connexis, Singapore 138632, Singapore.
authors.forename: Zhuangjian
authors.initials: Z
authors.lastname: Liu
authors.affiliation: #Department of Biomedical Engineering, Northwestern University, Evanston, Illinois 60208, United States.
authors.forename: Guillermo A
authors.initials: GA
authors.lastname: Ameer
authors.affiliation: §Department of Mechanical Engineering, Civil and Environmental Engineering, Center for Engineering and Health, and Skin Disease Research Center, Northwestern University, Evanston, Illinois 60208, United States.
authors.forename: Yonggang
authors.initials: Y
authors.lastname: Huang
authors.affiliation: ‡Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801, United States.|○Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801, United States.|◆Department of Chemistry, Mechanical Science and Engineering, Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801, United States.
authors.forename: John A
authors.initials: JA
authors.lastname: Rogers
mesh_terms: D015374:Biosensing Techniques / Q000379:methods*; D020724:Elastomers / Q000737:chemistry*; D004581:Electronics; D049329:Nanostructures / Q000737:chemistry; D036103:Nanotechnology / Q000379:methods*; D012666:Semiconductors; D012825:Silicon / Q000737:chemistry*
chemical_list: D020724:Elastomers; D012825:Silicon
keywords: Stretchable; biodegradable electronics; biosensors; flexible; transient