title: Ultrasonic welding for fast bonding of self-aligned structures in lab-on-a-chip systems.
abstract: Ultrasonic welding is a rapid, promising bonding method for the bonding of polymer chips; yet its use is still limited. We present two lab-on-a-chip applications where ultrasonic welding can be preferably applied: (1) self-aligned gapless bonding of a two-part chip with a tolerance of 50 μm; (2) bonding of a large area shallow chamber (1.8 cm(2) × 150 μm). Using injection moulding combined with ultrasonic welding we achieved a total production and bonding time of 60 s per chip, and a batch of chips could be produced within a day going from design to finished chips. We believe that the technical solutions offered here can significantly help bridge the gap between academia and industry, where the differences in production methods and materials pose a challenge when transferring technology.
authors: Department of Micro- and Nanotechnology, Technical University of Denmark, DTU Nanotech, Building 345 East, DK-2800 Kongens Lyngby, Denmark. Anders.Wolff@nanotech.dtu.dk.
authors: K
authors: K
authors: Kistrup
authors: C E
authors: CE
authors: Poulsen
authors: M F
authors: MF
authors: Hansen
authors: A
authors: A
authors: Wolff
mesh_terms: D056656:Lab-On-A-Chip Devices; D011108:Polymers / Q000737:chemistry; D000069453:Ultrasonic Waves; D014896:Welding / Q000379:methods*
chemical_list: D011108:Polymers