title: Extremely compact hybrid III-V/SOI lasers: design and fabrication approaches.
abstract: In this manuscript we discuss state of the art hybrid integration techniques and III-V/Si active components with an emphasis on hybrid distributed feedback (DFB) lasers for telecom applications. We review our work on ultra-compact III-V/Si DFB lasers and further describe design considerations and challenges associated with electrically pumped hybrid lasers. We conclude with a perspective on DFB lasers with extremely small footprint, a direction for future research with potential applications to densely-packed optical interconnects.
authors.forename: Olesya
authors.initials: O
authors.lastname: Bondarenko
authors.forename: Cheng-Yi
authors.initials: CY
authors.lastname: Fang
authors.forename: Felipe
authors.initials: F
authors.lastname: Vallini
authors.forename: Joseph S T
authors.initials: JS
authors.lastname: Smalley
authors.forename: Yeshaiahu
authors.initials: Y
authors.lastname: Fainman