title: A methodology for high resolution digital image correlation in high temperature experiments.
abstract: We propose a methodology for performing high resolution Digital Image Correlation (DIC) analysis during high-temperature mechanical tests. Specifically, we describe a technique for producing a stable, high-quality pattern on metal surfaces along with a simple optical system that uses a visible-range camera and a long-range microscope. The results are analyzed with a high-quality open-source DIC software developed by us. Using the proposed technique, we successfully acquired high-resolution strain maps of the crack tip field in a nickel superalloy sample at 1000 °C.
authors.affiliation: The Woodruff School of Mechanical Engineering, 801 Ferst Drive, Atlanta, Georgia 30332, USA.
authors.forename: Justin
authors.initials: J
authors.lastname: Blaber
authors.affiliation: The Woodruff School of Mechanical Engineering, 801 Ferst Drive, Atlanta, Georgia 30332, USA.
authors.forename: Benjamin S
authors.initials: BS
authors.lastname: Adair
authors.affiliation: The Woodruff School of Mechanical Engineering, 801 Ferst Drive, Atlanta, Georgia 30332, USA.
authors.forename: Antonia
authors.initials: A
authors.lastname: Antoniou