title: Robust Ag nanoplate ink for flexible electronics packaging.
abstract: Nanoinks are currently a topic of heightened interest with respect to low temperature bonding processes and printable electronics. We have developed an innovative polyvinylpyrrolidone (PVP)-stabilized Ag nanoplate ink amenable to very strong low temperature packaging, and investigated the relationship between bonding strength and electrical conductivity post-bonding. PVP shell plastic deformations observed in failure microcracks with the formation of PVP nanofibers, revealed bonding strength at low temperatures (<250 °C) was primarily due to adhesive bonding. It is found that, utilizing photonic sintering, ∼ 70 °C reduction of transformation temperature from adhesive to metallic bonding was achieved compared to that of thermal sintering. A numerical simulation was developed to better understand the influences of the light-induced heat generation, which demonstrated near-infrared light can facilitate sintering. Bonding strengths of 27 MPa were achieved at room temperatures, and 29.4 MPa at 210 °C with photonic sintering. Moreover, the anisotropic resistivity was observed with different thermal dependences. These results demonstrate Ag nanoplate inks have potential for low temperature 3D interconnections in lead-free microcircuits, flexible electronic packaging, and diverse sensing applications.
authors.affiliation: School of Electronic Science and Engineering, Southeast University, Key Laboratory of Micro-Inertial Instrument and Advanced Navigation Technology, Ministry of Education, Nanjing 210096, China. tzhang@seu.edu.cn.
authors.forename: Ruo-Zhou
authors.initials: RZ
authors.lastname: Li
authors.forename: Anming
authors.initials: A
authors.lastname: Hu
authors.forename: Denzel
authors.initials: D
authors.lastname: Bridges
authors.forename: Tong
authors.initials: T
authors.lastname: Zhang
authors.forename: Ken D
authors.initials: KD
authors.lastname: Oakes
authors.forename: Rui
authors.initials: R
authors.lastname: Peng
authors.forename: Uma
authors.initials: U
authors.lastname: Tumuluri
authors.forename: Zili
authors.initials: Z
authors.lastname: Wu
authors.forename: Zhili
authors.initials: Z
authors.lastname: Feng