title: High speed, high strength microwelding of Si/glass using ps-laser pulses.
abstract: A novel microwelding procedure to join Si-to-glass using ps-laser pulses with high repetition rates is presented. The procedure provides weld joint with mechanical strength as high as 85 MPa and 45 MPa in sample pairs of Si/aluminosilicate (Si/SW-Y) and Si/borosilicate (Si/Borofloat 33), respectively, which are higher than anodic bonding, at high spatial resolution (< 20 µm) and very high throughput without pre- and post-heating. Laser-matter interaction analysis indicates that excellent weld joint of Si/glass is obtained by avoiding violent evaporation of Si substrate using ps-laser pulses. Laser welded Si/glass samples can be singulated along the weld lines by standard blade dicer without defects, demonstrating welding by ps-laser pulses is applicable to wafer-level packaging.
authors.forename: Isamu
authors.initials: I
authors.lastname: Miyamoto
authors.forename: Yasuhiro
authors.initials: Y
authors.lastname: Okamoto
authors.forename: Assi
authors.initials: A
authors.lastname: Hansen
authors.forename: Joma
authors.initials: J
authors.lastname: Vihinen
authors.forename: Tiina
authors.initials: T
authors.lastname: Amberla
authors.forename: Jarno
authors.initials: J
authors.lastname: Kangastupa