title: Copper salts mediated morphological transformation of Cu2O from cubes to hierarchical flower-like or microspheres and their supercapacitors performances.
abstract: Monodisperse Cu2O of different microstructures, such as cubes, flower-like, and microspheres, have been extensively synthesized by a simple polyol reduction method using different copper salts, i.e. (Cu(acac)2, Cu(OH)2, and Cu(Ac)2·H2O). The effects of copper salts on the morphology of Cu2O were investigated in details through various characterization methods, including X-ray diffraction, transmission electron microscopy, scanning electron microscopy and UV-Vis absorption spectra. The effects of morphology on the electrochemical properties were further studied. Among the different structures, Cu2O with the microspheric morphology shows the highest specific capacitance and the best cycling stability compared with those of the other two structures, thus bear larger volume charge during the electrochemical reaction due to the microspheres of small nanoparticles.
authors: Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen, China.
authors: Liang
authors: L
authors: Chen
authors: Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen, China.
authors: Yu
authors: Y
authors: Zhang
authors: Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen, China.
authors: Pengli
authors: P
authors: Zhu
authors: Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen, China.
authors: Fengrui
authors: F
authors: Zhou
authors: School of Materials Science and Engineering, Nanjing University of Posts and Telecommunications.
authors: Wenjin
authors: W
authors: Zeng
authors: Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen, China.
authors: Daoqiang Daniel
authors: DD
authors: Lu
authors: Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen, China.
authors: Rong
authors: R
authors: Sun
authors: 1] Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen, China [2] School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, USA [3] Department of Electronics Engineering, The Chinese University of Hong Kong, Hong Kong, China.
authors: Chingping
authors: C
authors: Wong