title: Effect of hydrogen plasma on electroless-plating Ni-B films and its Cu diffusion barrier property.
abstract: Electroless-plating Ni-B films have been evaluated for the application as the diffusion barrier and metal cap for copper integration. The effect of post plasma treatment in a hydrogen environment on the characteristics of Ni-B films such as chemical composition, surface roughness, crystallinity, and resistivity was investigated. By treating electroless-plating Ni-B films with H2 plasma, the resistance and the roughness of the films decreased. The leakage current of Ni-B bottom electrode/30-nm-thick Al2O3/Al top electrode structures improved after the H2 plasma treatment on the Ni-B films. 40 nm-thick electroless-plating Ni-B film was able to block Cu diffusion up to 350 degrees C.
authors.forename: Kyeong-Keun
authors.initials: KK
authors.lastname: Choi
authors.forename: Jong
authors.initials: J
authors.lastname: Kee
authors.forename: Da-Jung
authors.initials: DJ
authors.lastname: Kwon
authors.forename: Deok-Kee
authors.initials: DK
authors.lastname: Kim
mesh_terms: D003300:Copper / Q000737:chemistry*; D004563:Electrochemistry; D018625:Microscopy, Atomic Force; D008855:Microscopy, Electron, Scanning; D046529:Microscopy, Electron, Transmission; D009532:Nickel / Q000737:chemistry*; D058626:Plasma Gases
chemical_list: D058626:Plasma Gases; D003300:Copper; D009532:Nickel