title: Rapid Low-Temperature 3D Integration of Silicon Nanowires on Flexible Substrates.
abstract: The vertical integration of 1D nanostructures onto the 2D substrates has the potential to offer significant performance gains to flexible electronic devices due to high integration density, large surface area, and improved light absorption and trapping. A simple, rapid, and low temperature transfer bonding method has been developed for this purpose. Ultrasonic vibration is used to achieve a low temperature bonding within a few seconds, resulting in a polymer-matrix-free, electrically conducting vertical assembly of silicon nanowires (SiNWs) with a graphene/PET substrate. The microscopic structure, and mechanical and electrical characteristics of the interface between the transferred SiNW array and graphene layer are subsequently investigated, revealing that this creates a mechanically robust and electrically Ohmic contact. This newly developed ultrasonic transfer bonding technique is also found to be readily adaptable for diverse substrates of both metal and polymer. It is therefore considered as a valuable technique for integrating 1D vertical nanostructures onto the 2D flexible substrates for flexible photovoltaics, energy storage, and water splitting systems.
authors.affiliation: Nano-Mechanical Systems Research Division, Korea Institute of Machinery and Materials (KIMM), 171 Jang-dong, Yuseong-gu, Daejeon, 305-343, South Korea.
authors.forename: Yoonkap
authors.initials: Y
authors.lastname: Kim
authors.affiliation: Nano-Mechanical Systems Research Division, Korea Institute of Machinery and Materials (KIMM), 171 Jang-dong, Yuseong-gu, Daejeon, 305-343, South Korea.
authors.forename: Han-Jung
authors.initials: HJ
authors.lastname: Kim
authors.affiliation: Nano-Mechanical Systems Research Division, Korea Institute of Machinery and Materials (KIMM), 171 Jang-dong, Yuseong-gu, Daejeon, 305-343, South Korea.
authors.forename: Jae-Hyun
authors.initials: JH
authors.lastname: Kim
authors.affiliation: Nano-Mechanical Systems Research Division, Korea Institute of Machinery and Materials (KIMM), 171 Jang-dong, Yuseong-gu, Daejeon, 305-343, South Korea.
authors.forename: Dae-Geun
authors.initials: DG
authors.lastname: Choi
authors.affiliation: Nano-Mechanical Systems Research Division, Korea Institute of Machinery and Materials (KIMM), 171 Jang-dong, Yuseong-gu, Daejeon, 305-343, South Korea.
authors.forename: Jun-Hyuk
authors.initials: JH
authors.lastname: Choi
authors.affiliation: Nano-Mechanical Systems Research Division, Korea Institute of Machinery and Materials (KIMM), 171 Jang-dong, Yuseong-gu, Daejeon, 305-343, South Korea.
authors.forename: Joo-Yun
authors.initials: JY
authors.lastname: Jung
authors.affiliation: Nano-Mechanical Systems Research Division, Korea Institute of Machinery and Materials (KIMM), 171 Jang-dong, Yuseong-gu, Daejeon, 305-343, South Korea.
authors.forename: Sohee
authors.initials: S
authors.lastname: Jeon
authors.affiliation: Nano-Mechanical Systems Research Division, Korea Institute of Machinery and Materials (KIMM), 171 Jang-dong, Yuseong-gu, Daejeon, 305-343, South Korea.
authors.forename: Eung-Sug
authors.initials: ES
authors.lastname: Lee
authors.affiliation: Nano-Mechanical Systems Research Division, Korea Institute of Machinery and Materials (KIMM), 171 Jang-dong, Yuseong-gu, Daejeon, 305-343, South Korea.
authors.forename: Jun-Ho
authors.initials: JH
authors.lastname: Jeong
authors.affiliation: Nano-Mechanical Systems Research Division, Korea Institute of Machinery and Materials (KIMM), 171 Jang-dong, Yuseong-gu, Daejeon, 305-343, South Korea.
authors.forename: Jihye
authors.initials: J
authors.lastname: Lee
keywords: flexible electronics; graphene; low temperature transfer bonding; silicon nanowires; ultrasonic vibration