title: Mechanical characterization between room temperature and 1000 °C of SiC free-standing thin films by a novel high-temperature micro-tensile setup.
abstract: A novel high-temperature micro-tensile setup allows the characterization of the elastic and plastic as well as creep behavior of free-standing thin films at temperatures of up to 1000 °C. Correspondingly, a new layout for free-standing thin film tensile test structures has been developed, enabling accurate self-alignment upon loading. Furthermore, a differential optical strain measurement technique as well as optimizations of the optical path has been implemented, providing a strain resolution of well below 1 × 10(-4) at 1000 °C. Two different polycrystalline SiC free-standing thin films have been investigated in tension to acquire stress-strain data and corresponding Young's modulus at up to 1000 °C. The high sensitivity of the strain measurement technique makes it also possible to identify creep strains in the high-temperature regime.
authors.affiliation: Institute for Applied Materials, Karlsruhe Institute of Technology (KIT), 76344 Eggenstein-Leopoldshafen, Germany.
authors.forename: D
authors.initials: D
authors.lastname: Leisen
authors.affiliation: Corporate Sector Research and Advance Engineering, Robert Bosch GmbH, 70049 Stuttgart, Germany.
authors.forename: R
authors.initials: R
authors.lastname: Rusanov
authors.affiliation: Corporate Sector Research and Advance Engineering, Robert Bosch GmbH, 70049 Stuttgart, Germany.
authors.forename: F
authors.initials: F
authors.lastname: Rohlfing
authors.affiliation: Corporate Sector Research and Advance Engineering, Robert Bosch GmbH, 70049 Stuttgart, Germany.
authors.forename: T
authors.initials: T
authors.lastname: Fuchs
authors.affiliation: Fraunhofer-Institut für Werkstoffmechanik IWM, 79108 Freiburg, Germany.
authors.forename: C
authors.initials: C
authors.lastname: Eberl
authors.affiliation: Institute for Applied Materials, Karlsruhe Institute of Technology (KIT), 76344 Eggenstein-Leopoldshafen, Germany.
authors.forename: H
authors.initials: H
authors.lastname: Riesch-Oppermann
authors.affiliation: Institute for Applied Materials, Karlsruhe Institute of Technology (KIT), 76344 Eggenstein-Leopoldshafen, Germany.
authors.forename: O
authors.initials: O
authors.lastname: Kraft