title: Low Temperature Sintering Cu6 Sn5 Nanoparticles for Superplastic and Super-uniform High Temperature Circuit Interconnections.
abstract: Brittle intermetallics such as Cu6 Sn5 can be transformed into low cost, nonbrittle, superplastic and high temperature-resistant interconnection materials by sintering at temperatures more than 200 °C lower than its bulk melting point. Confirmed via in situ TEM heating, the sintered structure is pore-free with nanograins, and the interface is super-uniform.
authors.affiliation: State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, 150001, China.|Materials Science and Engineering, University of California at San Diego, 9500 Gilman Dr., La Jolla, CA, 92093, USA.
authors.forename: Ying
authors.initials: Y
authors.lastname: Zhong
authors.affiliation: State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, 150001, China.|Key Laboratory of Microsystems and Microstructures Manufacturing, Ministry of Education, Harbin Institute of Technology, Harbin, 150080, China.
authors.forename: Rong
authors.initials: R
authors.lastname: An
authors.affiliation: State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, 150001, China.|Key Laboratory of Microsystems and Microstructures Manufacturing, Ministry of Education, Harbin Institute of Technology, Harbin, 150080, China.
authors.forename: Chunqing
authors.initials: C
authors.lastname: Wang
authors.affiliation: State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, 150001, China.
authors.forename: Zhen
authors.initials: Z
authors.lastname: Zheng
authors.affiliation: Institute of Metal Research, Chinese Academy of Sciences, Shenyang, 110016, China.
authors.forename: Zhi-Quan
authors.initials: ZQ
authors.lastname: Liu
authors.affiliation: Materials Science and Engineering, University of California at San Diego, 9500 Gilman Dr., La Jolla, CA, 92093, USA.
authors.forename: Chin-Hung
authors.initials: CH
authors.lastname: Liu
authors.affiliation: Institute of Metal Research, Chinese Academy of Sciences, Shenyang, 110016, China.
authors.forename: Cai-Fu
authors.initials: CF
authors.lastname: Li
authors.affiliation: Materials Science and Engineering, University of California at San Diego, 9500 Gilman Dr., La Jolla, CA, 92093, USA.
authors.forename: Tae Kyoung
authors.initials: TK
authors.lastname: Kim
authors.affiliation: Materials Science and Engineering, University of California at San Diego, 9500 Gilman Dr., La Jolla, CA, 92093, USA.
authors.forename: Sungho
authors.initials: S
authors.lastname: Jin
keywords: TEM; high temperature interconnection; intermetallics; nanoparticles; sintering