title: Improved electro-mechanical performance of gold films on polyimide without adhesion layers.
abstract: Thin metal films on polymer substrates are of interest for flexible electronic applications and often utilize a thin interlayer to improve adhesion of metal films on flexible substrates. This work investigates the effect of a 10 nm Cr interlayer on the electro-mechanical properties of 50 nm Au films on polyimide substrates. Ex situ and in situ fragmentation experiments reveal the Cr interlayer causes brittle electro-mechanical behaviour, and thin Au films without an interlayer can support strains up to 15% without significantly degrading electrical conductivity.
authors.affiliation: Department of Materials Physics, Montanuniversität Leoben, Jahnstrasse 12, Leoben 8700, Austria ; Erich Schmid Institute of Materials Science, Austrian Academy of Sciences, Jahnstrasse 12, Leoben 8700, Austria.
authors.forename: Barbara
authors.initials: B
authors.lastname: Putz
authors.affiliation: School of Mechanical and Materials Engineering, Washington State University, Pullman, WA 99164, United States.
authors.forename: Rachel L
authors.initials: RL
authors.lastname: Schoeppner
authors.affiliation: Erich Schmid Institute of Materials Science, Austrian Academy of Sciences, Jahnstrasse 12, Leoben 8700, Austria.
authors.forename: Oleksandr
authors.initials: O
authors.lastname: Glushko
authors.affiliation: School of Mechanical and Materials Engineering, Washington State University, Pullman, WA 99164, United States ; School of Materials Engineering, Purdue University, West Lafayette, IN 47907, United States.
authors.forename: David F
authors.initials: DF
authors.lastname: Bahr
authors.affiliation: Erich Schmid Institute of Materials Science, Austrian Academy of Sciences, Jahnstrasse 12, Leoben 8700, Austria.
authors.forename: Megan J
authors.initials: MJ
authors.lastname: Cordill
keywords: Electrical resistivity; Fracture; Fragmentation; Mechanical properties; Thin films