title: Performance evaluation of multi-stratum resources integrated resilience for software defined inter-data center interconnect.
abstract: Inter-data center interconnect with IP over elastic optical network (EON) is a promising scenario to meet the high burstiness and high-bandwidth requirements of data center services. In our previous work, we implemented multi-stratum resources integration among IP networks, optical networks and application stratums resources that allows to accommodate data center services. In view of this, this study extends to consider the service resilience in case of edge optical node failure. We propose a novel multi-stratum resources integrated resilience (MSRIR) architecture for the services in software defined inter-data center interconnect based on IP over EON. A global resources integrated resilience (GRIR) algorithm is introduced based on the proposed architecture. The MSRIR can enable cross stratum optimization and provide resilience using the multiple stratums resources, and enhance the data center service resilience responsiveness to the dynamic end-to-end service demands. The overall feasibility and efficiency of the proposed architecture is experimentally verified on the control plane of our OpenFlow-based enhanced SDN (eSDN) testbed. The performance of GRIR algorithm under heavy traffic load scenario is also quantitatively evaluated based on MSRIR architecture in terms of path blocking probability, resilience latency and resource utilization, compared with other resilience algorithms.
authors.forename: Hui
authors.initials: H
authors.lastname: Yang
authors.forename: Jie
authors.initials: J
authors.lastname: Zhang
authors.forename: Yongli
authors.initials: Y
authors.lastname: Zhao
authors.forename: Yuefeng
authors.initials: Y
authors.lastname: Ji
authors.forename: Jialin
authors.initials: J
authors.lastname: Wu
authors.forename: Yi
authors.initials: Y
authors.lastname: Lin
authors.forename: Jianrui
authors.initials: J
authors.lastname: Han
authors.forename: Young
authors.initials: Y
authors.lastname: Lee