title: Ultra-compact 32 × 32 strictly-non-blocking Si-wire optical switch with fan-out LGA interposer.
abstract: We demonstrate a 32 × 32 path-independent-insertion-loss optical path switch that integrates 1024 thermooptic Mach-Zehnder switches and 961 intersections on a small, 11 × 25 mm2 die. The switch is fabricated on a 300-mm-diameter silicon-on-insulator wafer by a complementary metal-oxide semiconductor-compatible process with advanced ArF immersion lithography. For reliable electrical packaging, the switch chip is flip-chip bonded to a ceramic interposer that arranges the electrodes in a 0.5-mm pitch land grid array. The on-chip loss is measured to be 15.8 ± 1.0 dB, and successful switching is demonstrated for digital-coherent 43-Gb/s QPSK signals. The total crosstalk of the switch is estimated to be less than -20 dB at the center wavelength of 1545 nm. The bandwidth narrowing caused by dimensional errors that arise during fabrication is discussed.
authors.forename: Ken
authors.initials: K
authors.lastname: Tanizawa
authors.forename: Keijiro
authors.initials: K
authors.lastname: Suzuki
authors.forename: Munehiro
authors.initials: M
authors.lastname: Toyama
authors.forename: Minoru
authors.initials: M
authors.lastname: Ohtsuka
authors.forename: Nobuyuki
authors.initials: N
authors.lastname: Yokoyama
authors.forename: Kazuyuki
authors.initials: K
authors.lastname: Matsumaro
authors.forename: Miyoshi
authors.initials: M
authors.lastname: Seki
authors.forename: Keiji
authors.initials: K
authors.lastname: Koshino
authors.forename: Toshio
authors.initials: T
authors.lastname: Sugaya
authors.forename: Satoshi
authors.initials: S
authors.lastname: Suda
authors.forename: Guangwei
authors.initials: G
authors.lastname: Cong
authors.forename: Toshio
authors.initials: T
authors.lastname: Kimura
authors.forename: Kazuhiro
authors.initials: K
authors.lastname: Ikeda
authors.forename: Shu
authors.initials: S
authors.lastname: Namiki
authors.forename: Hitoshi
authors.initials: H
authors.lastname: Kawashima