Electron Channeling Contrast Imaging for Rapid III-V Heteroepitaxial Characterization.
Misfit dislocations in heteroepitaxial layers of GaP grown on Si(001) substrates are characterized through use of electron channeling contrast imaging (ECCI) in a scanning electron microscope (SEM). ECCI allows for imaging of defects and crystallographic features under specific diffraction conditions, similar to that possible via plan-view transmission electron microscopy (PV-TEM). A particular advantage of the ECCI technique is that it requires little to no sample preparation, and indeed can use large area, as-produced samples, making it a considerably higher throughput characterization method than TEM. Similar to TEM, different diffraction conditions can be obtained with ECCI by tilting and rotating the sample in the SEM. This capability enables the selective imaging of specific defects, such as misfit dislocations at the GaP/Si interface, with high contrast levels, which are determined by the standard invisibility criteria. An example application of this technique is described wherein ECCI imaging is used to determine the critical thickness for dislocation nucleation for GaP-on-Si by imaging a range of samples with various GaP epilayer thicknesses. Examples of ECCI micrographs of additional defect types, including threading dislocations and a stacking fault, are provided as demonstration of its broad, TEM-like applicability. Ultimately, the combination of TEM-like capabilities - high spatial resolution and richness of microstructural data - with the convenience and speed of SEM, position ECCI as a powerful tool for the rapid characterization of crystalline materials.
Department of Materials Science and Engineering, The Ohio State University.
Julia I
JI
Deitz
Department of Electrical and Computer Engineering, The Ohio State University.
Santino D
SD
Carnevale
Institute of Materials Research, The Ohio State University.
Steven A
SA
Ringel
Institute of Materials Research, The Ohio State University.
David W
DW
McComb
Department of Materials Science and Engineering, The Ohio State University; Department of Electrical and Computer Engineering, The Ohio State University; grassman.5@osu.edu.
Tyler J
TJ
Grassman