Flip Chip Bonding of a Quartz MEMS-Based Vibrating Beam Accelerometer.
In this study, a novel method to assemble a micro-accelerometer by a flip chip bonding technique is proposed and demonstrated. Both the main two parts of the accelerometer, a double-ended tuning fork and a base-proof mass structure, are fabricated using a quartz wet etching process on Z cut quartz wafers with a thickness of 100 μm and 300 μm, respectively. The finite element method is used to simulate the vibration mode and optimize the sensing element structure. Taking advantage of self-alignment function of the flip chip bonding process, the two parts were precisely bonded at the desired joint position via AuSn solder. Experimental demonstrations were performed on a maximum scale of 4 × 8 mm² chip, and high sensitivity up to 9.55 Hz/g with a DETF resonator and a Q value of 5000 in air was achieved.
Key Laboratory of Micro-Inertial Instrument and Advanced Navigation Technology, Ministry of Education, School of Instrument Science and Engineering, Southeast University, Nanjing 210096, China. j-liang@seu.edu.cn.
Jinxing
J
Liang
Key Laboratory of Micro-Inertial Instrument and Advanced Navigation Technology, Ministry of Education, School of Instrument Science and Engineering, Southeast University, Nanjing 210096, China. violetyuan7@126.com.
Liyuan
L
Zhang
School of Automation, Southeast University, Nanjing 210096, China. 213122024@seu.edu.cn.
Ling
L
Wang
Key Laboratory of Micro-Inertial Instrument and Advanced Navigation Technology, Ministry of Education, School of Instrument Science and Engineering, Southeast University, Nanjing 210096, China. 213113391@seu.edu.cn.
Yuan
Y
Dong
Graduate School of Information, Production and Systems, Waseda University, Kitakyushu 808-0135, Japan. t-ueda@waseda.jp.
Toshitsugu
T
Ueda
double ended tuning fork; flip chip bonding; quartz MEMS; self-alignment; vibrating beam accelerometer