Fractal dendrite-based electrically conductive composites for laser-scribed flexible circuits.
Fractal metallic dendrites have been drawing more attentions recently, yet they have rarely been explored in electronic printing or packaging applications because of the great challenges in large-scale synthesis and limited understanding in such applications. Here we demonstrate a controllable synthesis of fractal Ag micro-dendrites at the hundred-gram scale. When used as the fillers for isotropically electrically conductive composites (ECCs), the unique three-dimensional fractal geometrical configuration and low-temperature sintering characteristic render the Ag micro dendrites with an ultra-low electrical percolation threshold of 0.97 vol% (8 wt%). The ultra-low percolation threshold and self-limited fusing ability may address some critical challenges in current interconnect technology for microelectronics. For example, only half of the laser-scribe energy is needed to pattern fine circuit lines printed using the present ECCs, showing great potential for wiring ultrathin circuits for high performance flexible electronics.
Division of Energy and Environment, Graduate School at Shenzhen, Tsinghua University, Shenzhen 518055, China.
Cheng
C
Yang
Division of Energy and Environment, Graduate School at Shenzhen, Tsinghua University, Shenzhen 518055, China.
Xiaoya
X
Cui
Division of Energy and Environment, Graduate School at Shenzhen, Tsinghua University, Shenzhen 518055, China.
Zhexu
Z
Zhang
Division of Energy and Environment, Graduate School at Shenzhen, Tsinghua University, Shenzhen 518055, China.
Sum Wai
SW
Chiang
School of Materials Science and Engineering, Georgia Institute of Technology, 771, Ferst Dr, Atlanta, Georgia 30332, USA.
Wei
W
Lin
Division of Energy and Environment, Graduate School at Shenzhen, Tsinghua University, Shenzhen 518055, China.
Huan
H
Duan
Division of Energy and Environment, Graduate School at Shenzhen, Tsinghua University, Shenzhen 518055, China.
Jia
J
Li
Division of Energy and Environment, Graduate School at Shenzhen, Tsinghua University, Shenzhen 518055, China.|School of Materials Science and Engineering, Tsinghua University, Beijing 100084, China.
Feiyu
F
Kang
Department of Electronic Engineering, The Chinese University of Hong Kong, Shatin, Hong Kong, China.
Ching-Ping
CP
Wong