title: Optical transmission between III-V chips on Si using photonic wire bonding.
abstract: Photonic wire bonding (PWB) was used to achieve flexible chip-scale optical interconnection as a kind of 3D-freeform polymer waveguide based on the two-photon polymerization of SU-8. First, the fabrication conditions of PWB were determined for the two-photon absorption process, and the coupling structure between PWB and III-V optical components was numerically simulated in order to obtain high coupling efficiency. Then, using PWB, chip-to-chip optical transmission was realized between laser and detector chips located on a common Si substrate. We fabricated a 2.5-μm-wide PWB with 1:3 aspect ratio between two optical chips of 140-μm gap and achieved a connection loss of approximately 10 dB.
authors.forename: Zhichen
authors.initials: Z
authors.lastname: Gu
authors.forename: Tomohiro
authors.initials: T
authors.lastname: Amemiya
authors.forename: Atsushi
authors.initials: A
authors.lastname: Ishikawa
authors.forename: Takuo
authors.initials: T
authors.lastname: Hiratani
authors.forename: Junichi
authors.initials: J
authors.lastname: Suzuki
authors.forename: Nobuhiko
authors.initials: N
authors.lastname: Nishiyama
authors.forename: Takuo
authors.initials: T
authors.lastname: Tanaka
authors.forename: Shigehisa
authors.initials: S
authors.lastname: Arai