title: High-level integration of three-dimensional microcoils array in fused silica.
abstract: Rapid and facile creation of three-dimensional (3D) microcoils array in a "lab-on-a-chip" platform is a big challenge in micromachining. Here we report a method based on an improved femtosecond-laser wet-etch (FLWE) technology and metal-microsolidifying process for the fabrication of 3D microcoils array inside fused silica. Based on this approach, we fabricated microcoil arrays such as 3×3 O-shaped microcoils array and 4×4 liner microcoils array. By injecting high-melting-point alloy, the electrocircuit of microcoils array can hardly be disconnected. The microcoils array also exhibits good uniformity and a high integration level. It shows promise as a real application device.
authors.forename: Chao
authors.initials: C
authors.lastname: Shan
authors.forename: Feng
authors.initials: F
authors.lastname: Chen
authors.forename: Qing
authors.initials: Q
authors.lastname: Yang
authors.forename: Yanyang
authors.initials: Y
authors.lastname: Li
authors.forename: Hao
authors.initials: H
authors.lastname: Bian
authors.forename: Jiale
authors.initials: J
authors.lastname: Yong
authors.forename: Xun
authors.initials: X
authors.lastname: Hou