title: Rapid Copper Metallization of Textile Materials: a Controlled Two-Step Route to Achieve User-Defined Patterns under Ambient Conditions.
abstract: Throughout history earth-abundant copper has been incorporated into textiles and it still caters to various needs in modern society. In this paper, we present a two-step copper metallization strategy to realize sequentially nondiffusive copper(II) patterning and rapid copper deposition on various textile materials, including cotton, polyester, nylon, and their mixtures. A new, cost-effective formulation is designed to minimize the copper pattern migration on textiles and to achieve user-defined copper patterns. The metallized copper is found to be very adhesive and stable against washing and oxidation. Furthermore, the copper-metallized textile exhibits excellent electrical conductivity that is ~3 times better than that of stainless steel and also inhibits the growth of bacteria effectively. This new copper metallization approach holds great promise as a commercially viable method to metallize an insulating textile, opening up research avenues for wearable electronics and functional garments.
authors.affiliation: Institute of Materials Research and Engineering, Agency for Science, Technology and Research (A*STAR) , Singapore 117602, Singapore.
authors.forename: Shuang-Yuan
authors.initials: SY
authors.lastname: Zhang
authors.affiliation: Institute of Materials Research and Engineering, Agency for Science, Technology and Research (A*STAR) , Singapore 117602, Singapore.|Institute of Intelligent Machines, Chinese Academy of Sciences , Hefei 230031, China.
authors.forename: Guijian
authors.initials: G
authors.lastname: Guan
authors.affiliation: Institute of Materials Research and Engineering, Agency for Science, Technology and Research (A*STAR) , Singapore 117602, Singapore.|College of Chemistry, Jilin University , Changchun 130012, China.
authors.forename: Shan
authors.initials: S
authors.lastname: Jiang
authors.affiliation: Institute of Materials Research and Engineering, Agency for Science, Technology and Research (A*STAR) , Singapore 117602, Singapore.
authors.forename: Hongchen
authors.initials: H
authors.lastname: Guo
authors.affiliation: School of Materials Science and Engineering, Nanyang Technological University , Singapore 639798, Singapore.
authors.forename: Jing
authors.initials: J
authors.lastname: Xia
authors.affiliation: Institute of Materials Research and Engineering, Agency for Science, Technology and Research (A*STAR) , Singapore 117602, Singapore.
authors.forename: Michelle D
authors.initials: MD
authors.lastname: Regulacio
authors.affiliation: School of Materials Science and Engineering, Nanyang Technological University , Singapore 639798, Singapore.
authors.forename: Mingda
authors.initials: M
authors.lastname: Wu
authors.affiliation: Institute of Materials Research and Engineering, Agency for Science, Technology and Research (A*STAR) , Singapore 117602, Singapore.
authors.forename: Kwok Wei
authors.initials: KW
authors.lastname: Shah
authors.affiliation: School of Materials Science and Engineering, Nanyang Technological University , Singapore 639798, Singapore.
authors.forename: Zhili
authors.initials: Z
authors.lastname: Dong
authors.affiliation: Institute of Materials Research and Engineering, Agency for Science, Technology and Research (A*STAR) , Singapore 117602, Singapore.
authors.forename: Jie
authors.initials: J
authors.lastname: Zhang
authors.affiliation: Institute of Materials Research and Engineering, Agency for Science, Technology and Research (A*STAR) , Singapore 117602, Singapore.
authors.forename: Ming-Yong
authors.initials: MY
authors.lastname: Han
mesh_terms: D000900:Anti-Bacterial Agents / Q000494:pharmacology; D003300:Copper / Q000737:chemistry*; D032561:Cotton Fiber; D004058:Diffusion; D004553:Electric Conductivity; D004926:Escherichia coli / Q000187:drug effects; D008826:Microbial Sensitivity Tests; D008855:Microscopy, Electron, Scanning; D019163:Reducing Agents / Q000737:chemistry; D013211:Staphylococcus aureus / Q000187:drug effects; D013784:Textiles; D014961:X-Ray Diffraction
chemical_list: D000900:Anti-Bacterial Agents; D019163:Reducing Agents; D003300:Copper
keywords: autocatalytic plating; chemical plating; electroless copper plating; textile metallization; wearable electronics