title: Cleavable Ligands Enable Uniform Close Packing in Colloidal Quantum Dot Solids.
abstract: Uniform close packing in colloidal quantum dot solids is critical for high-optical density, high-mobility optoelectronic devices. A hybrid-ligand strategy is developed, combining the advantages of solid state and solution-phase ligand exchanges. This strategy uses a medium length thioamide ligand that is readily cleaved in a single chemical treatment, leading to quantum dot solids with uniformly packed domains 3 times larger than those observed in ligand-exchanged films.
authors.affiliation: The Edward S. Rogers Department of Electrical and Computer Engineering, University of Toronto , 10 King's College Road, Toronto, Ontario M5S 3G4, Canada.
authors.forename: Graham H
authors.initials: GH
authors.lastname: Carey
authors.affiliation: The Edward S. Rogers Department of Electrical and Computer Engineering, University of Toronto , 10 King's College Road, Toronto, Ontario M5S 3G4, Canada.
authors.forename: Mingjian
authors.initials: M
authors.lastname: Yuan
authors.affiliation: The Edward S. Rogers Department of Electrical and Computer Engineering, University of Toronto , 10 King's College Road, Toronto, Ontario M5S 3G4, Canada.
authors.forename: Riccardo
authors.initials: R
authors.lastname: Comin
authors.affiliation: The Edward S. Rogers Department of Electrical and Computer Engineering, University of Toronto , 10 King's College Road, Toronto, Ontario M5S 3G4, Canada.
authors.forename: Oleksandr
authors.initials: O
authors.lastname: Voznyy
authors.affiliation: The Edward S. Rogers Department of Electrical and Computer Engineering, University of Toronto , 10 King's College Road, Toronto, Ontario M5S 3G4, Canada.
authors.forename: Edward H
authors.initials: EH
authors.lastname: Sargent
keywords: colloidal quantum dot; densification; ligand cleavage; thin films; thioamide